Study of Stealth Dicing of Silicon Carbide Wafers Under Ultrafast Laser Multi‑Pulse Mode and Burst Mode

Yunpeng Ren; Xincheng Tu; Kun He; Li Cheng; Yunxia Ye; Xudong Ren; Naifei Ren

doi:10.3788/CJL230517

Chinese Journal of Lasers, Volume. 50, Issue 20, 2002405(2023)

Study of Stealth Dicing of Silicon Carbide Wafers Under Ultrafast Laser Multi‑Pulse Mode and Burst Mode

Yunpeng Ren^*, Xincheng Tu, Kun He, Li Cheng, Yunxia Ye, Xudong Ren, and Naifei Ren

Author Affiliations

School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu, China

show less

Abstract Get PDF(in Chinese)

Cited By

Article index updated: Mar. 10, 2025

The article is cited by 2 article(s) CLP online library. (Some content might be in Chinese.)

Tools

Get Citation

Copy Citation Text

Yunpeng Ren, Xincheng Tu, Kun He, Li Cheng, Yunxia Ye, Xudong Ren, Naifei Ren. Study of Stealth Dicing of Silicon Carbide Wafers Under Ultrafast Laser Multi‑Pulse Mode and Burst Mode[J]. Chinese Journal of Lasers, 2023, 50(20): 2002405

Download Citation

EndNote(RIS)BibTex Plain Text

Set citation alerts for article

Save article for my favorites

Paper Information

Category: Laser Micro-Nano Manufacturing

Received: Feb. 13, 2023

Accepted: Apr. 3, 2023

Published Online: Aug. 10, 2023

The Author Email: Ren Yunpeng (renyp@ujs.edu.cn)

DOI:10.3788/CJL230517

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology