International Journal of Extreme Manufacturing, Volume. 7, Issue 3, 35103(2025)

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Gao Shang, Wang Haoxiang, Huang Han, Dong Zhigang, and Kang Renke
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Gao Shang, Wang Haoxiang, Huang Han, Dong Zhigang, Kang Renke. Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding[J]. International Journal of Extreme Manufacturing, 2025, 7(3): 35103

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Received: Oct. 31, 2024

Accepted: Sep. 29, 2025

Published Online: Sep. 29, 2025

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DOI:10.1088/2631-7990/adae67

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