International Journal of Extreme Manufacturing, Volume. 7, Issue 3, 35103(2025)
Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding
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Gao Shang, Wang Haoxiang, Huang Han, Dong Zhigang, Kang Renke. Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding[J]. International Journal of Extreme Manufacturing, 2025, 7(3): 35103
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Received: Oct. 31, 2024
Accepted: Sep. 29, 2025
Published Online: Sep. 29, 2025
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