Chinese Journal of Lasers, Volume. 47, Issue 4, 403001(2020)

Material Removal Characteristics of Polishing Pad with Small-Tool Correction

Sun Rongkang1, Wang Jindong1、*, Cheng Cong1, and Liao Defeng2
Author Affiliations
  • 1School of Mechanical Engineering, Southwest Jiaotong University, Chengdu, Sichuan 610031, China
  • 2Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang, Sichuan 621900, China
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    Figures & Tables(13)
    Schematic of continuous polishing
    Distribution of sampling points on polishing pad surface. (a) Spiral distribution; (b) circle distribution; (c) radial linear distribution
    Straightness detection of guide
    Test results of straightness of guide
    Schematic for tilt detection of rotating axis of polishing pad
    Schematic of polishing pad surface shape detection
    Three detected actual surface shapes of polishing pad under the same conditions
    Structure sketch of small-tool
    Relative motion analysis of small-tool
    Simulation result of small-tool correction
    Radial profile comparison of polishing pad before and after correction
    Comparison between theoretical and experimental results
    • Table 1. Detection results of inclination of pad rotation axis10-3 mm·m-1

      View table

      Table 1. Detection results of inclination of pad rotation axis10-3 mm·m-1

      No.S1S2
      1706506
      2704503
      3699504
      4694500
      Average value700.8503.3
      α98.75
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    Sun Rongkang, Wang Jindong, Cheng Cong, Liao Defeng. Material Removal Characteristics of Polishing Pad with Small-Tool Correction[J]. Chinese Journal of Lasers, 2020, 47(4): 403001

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    Paper Information

    Category: materials and thin films

    Received: Sep. 16, 2019

    Accepted: --

    Published Online: Apr. 8, 2020

    The Author Email: Jindong Wang (wangjindong@swjtu.edu.cn)

    DOI:10.3788/CJL202047.0403001

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