Chinese Journal of Lasers, Volume. 47, Issue 4, 403001(2020)
Material Removal Characteristics of Polishing Pad with Small-Tool Correction
Fig. 2. Distribution of sampling points on polishing pad surface. (a) Spiral distribution; (b) circle distribution; (c) radial linear distribution
Fig. 7. Three detected actual surface shapes of polishing pad under the same conditions
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Sun Rongkang, Wang Jindong, Cheng Cong, Liao Defeng. Material Removal Characteristics of Polishing Pad with Small-Tool Correction[J]. Chinese Journal of Lasers, 2020, 47(4): 403001
Category: materials and thin films
Received: Sep. 16, 2019
Accepted: --
Published Online: Apr. 8, 2020
The Author Email: Jindong Wang (wangjindong@swjtu.edu.cn)