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Chinese Journal of Lasers, Volume. 47, Issue 4, 403001(2020)

Material Removal Characteristics of Polishing Pad with Small-Tool Correction

Sun Rongkang1, Wang Jindong1、*, Cheng Cong1, and Liao Defeng2
Author Affiliations
  • 1School of Mechanical Engineering, Southwest Jiaotong University, Chengdu, Sichuan 610031, China
  • 2Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang, Sichuan 621900, China
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    Article index updated: Mar. 10, 2025

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    Sun Rongkang, Wang Jindong, Cheng Cong, Liao Defeng. Material Removal Characteristics of Polishing Pad with Small-Tool Correction[J]. Chinese Journal of Lasers, 2020, 47(4): 403001

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    Paper Information

    Category: materials and thin films

    Received: Sep. 16, 2019

    Accepted: --

    Published Online: Apr. 8, 2020

    The Author Email: Jindong Wang (wangjindong@swjtu.edu.cn)

    DOI:10.3788/CJL202047.0403001

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology