Chinese Journal of Lasers, Volume. 47, Issue 4, 403001(2020)

Material Removal Characteristics of Polishing Pad with Small-Tool Correction

Sun Rongkang1, Wang Jindong1、*, Cheng Cong1, and Liao Defeng2
Author Affiliations
  • 1School of Mechanical Engineering, Southwest Jiaotong University, Chengdu, Sichuan 610031, China
  • 2Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang, Sichuan 621900, China
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    Continuous polishing is the preferred method for processing large-aperture planar optical materials, especially playing an important role in ultra-precision processing of optics. The surface accuracy of components is directly affected by the surface shape of the polishing pad. To study the removal characteristics of polishing-pad surface materials with small-tools, accurately measuring the surface shape of the polishing pad is necessary. In this paper, the height of spiral sample points on the surface of a polishing pad is collected by laser displacement sensor, and the experimental detection errors are analyzed and calibrated. Subsequently, the actual shape of the polishing pad surface is calculated. Using a computer controlled polishing method for reference, the material-removal model of the polishing pad with tool correction is established, the material removal function of the pad in the correction range of the small-tool is simulated and calculated, and the material-removal characteristics of the polishing pad are analyzed. Finally, the correctness of the simulation results is verified with a small-tool correction experiment, which provides a theoretical basis for shape modification of the polishing pad.

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    Sun Rongkang, Wang Jindong, Cheng Cong, Liao Defeng. Material Removal Characteristics of Polishing Pad with Small-Tool Correction[J]. Chinese Journal of Lasers, 2020, 47(4): 403001

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    Paper Information

    Category: materials and thin films

    Received: Sep. 16, 2019

    Accepted: --

    Published Online: Apr. 8, 2020

    The Author Email: Jindong Wang (wangjindong@swjtu.edu.cn)

    DOI:10.3788/CJL202047.0403001

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