Optics and Precision Engineering, Volume. 32, Issue 16, 2492(2024)

Preparation of Ni microneedle array using thin photoresist microelectroforming technique

Huaan WANG1, Xiaojian LI1, Penghe YIN1, Jiaxin SONG1, Yu ZHANG1, and Junsheng LIANG1,2、*
Author Affiliations
  • 1Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian6023, China
  • 2State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian11603, China
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    Figures & Tables(11)
    Fabrication process of Ni microneedle arrays
    Mask used for second lithography
    Microelectroforming process for thin photoresist silicon template
    Ni microneedle arrays after ultrasonic release
    Ni microneedle arrays after chemical release
    New mask used for second lithography
    Ni microneedle arrays after physical release
    SEM image of Ni microneedle tip
    Length and width at the base of the Ni microneedle arrays
    Statistics scatter plot of the Ni microneedle arrays size
    Deviation histogram of the actual position versus the designed position of the Ni microneedle arrays
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    Huaan WANG, Xiaojian LI, Penghe YIN, Jiaxin SONG, Yu ZHANG, Junsheng LIANG. Preparation of Ni microneedle array using thin photoresist microelectroforming technique[J]. Optics and Precision Engineering, 2024, 32(16): 2492

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    Paper Information

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    Received: Feb. 5, 2024

    Accepted: --

    Published Online: Nov. 18, 2024

    The Author Email: Junsheng LIANG (jsliang@dlut.edu.cn)

    DOI:10.37188/OPE.20243216.2492

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