Photonics Research, Volume. 10, Issue 2, A14(2022)

Wafer-level hermetically sealed silicon photonic MEMS

Gaehun Jo1, Pierre Edinger1, Simon J. Bleiker1, Xiaojing Wang1, Alain Yuji Takabayashi2, Hamed Sattari2, Niels Quack2, Moises Jezzini3, Jun Su Lee3, Peter Verheyen4, Iman Zand5, Umar Khan5, Wim Bogaerts5, Göran Stemme1, Kristinn B. Gylfason1,6、*, and Frank Niklaus1,7、*
Author Affiliations
  • 1Division of Micro and Nanosystems, KTH Royal Institute of Technology, 11428 Stockholm, Sweden
  • 2École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland
  • 3Tyndall National Institute, Lee Maltings Complex Dyke Parade, T12 R5CP Cork, Ireland
  • 4imec vzw. 3DSIP Department, Si Photonics Group, Kapeldreef 75, 3001 Leuven, Belgium
  • 5Department of Information Technology, Photonics Research Group, Ghent University - IMEC, 9052 Gent, Belgium
  • 6e-mail: gylfason@kth.se
  • 7e-mail: frank@kth.se
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    Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, Frank Niklaus, "Wafer-level hermetically sealed silicon photonic MEMS," Photonics Res. 10, A14 (2022)

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    Paper Information

    Special Issue: NEXT-GENERATION SILICON PHOTONICS

    Received: Aug. 25, 2021

    Accepted: Nov. 23, 2021

    Published Online: Jan. 13, 2022

    The Author Email: Kristinn B. Gylfason (gylfason@kth.se), Frank Niklaus (frank@kth.se)

    DOI:10.1364/PRJ.441215

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