NUCLEAR TECHNIQUES, Volume. 45, Issue 11, 110402(2022)

Design of a TDC chip based on 0.18 μm SMIC technology

Yichao MA1, Liangyi WANG1, Haiyun TENG2、*, and Junguo JIANG1
Author Affiliations
  • 1Shaanxi University of Science & Technology, Xi'an 710021, China
  • 2Institute of High Energy Physics, Chinese Academy of Sciences, Dongguan 523000, China
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    Figures & Tables(20)
    Diagram of TDC chip structure
    Differential delay chain TDC
    Differential delay ring TDC
    Diagram of judgment unit combination(a) TDC first loop operation, (b) TDC second loop operation
    Sequence diagram of differential ring TDC
    Structure diagram of arbiter (a) Rise edge arbiter, (b) Falling edge arbiter
    Operating cycle of arbiter A
    Unexpected "01" conversion of arbiter B
    The sequence diagram shows that the register group filters out the false "01" at the falling edge (a) Fake "01" sequence diagram, (b) Sequence diagram after filtering fake "01"
    Sequence diagram of B1 (a) and B2 (b)
    Chip layout
    TDC chip diagram
    Calibration curve of delay ring
    Time accuracy of TDC
    Comparison of local time difference
    Comparison of overall time difference
    Counts of each TDC delay bin
    DNL test results
    INL test results
    • Table 1. Comparison of TDC chips with different designs

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      Table 1. Comparison of TDC chips with different designs

      参考文献

      Reference

      工艺

      Technology

      面积

      Area / μm2

      分辨率

      Resolution / ps

      时钟频率

      Clock frequency / MHz

      功耗

      Power loss / mW

      [1]0.11 μm CMOS600×3 00051.7600<100
      [2]SMIC 0.18 μm CMOS120×12032125
      [3]0.13 μm GSMC300×40701.36
      [6]0.13 μm CMOS57
      [17]0.18 μm CMOS160<8
      本文 This paper0.18 μm SMIC1 350×1 35017250
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    Yichao MA, Liangyi WANG, Haiyun TENG, Junguo JIANG. Design of a TDC chip based on 0.18 μm SMIC technology[J]. NUCLEAR TECHNIQUES, 2022, 45(11): 110402

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    Paper Information

    Category: Research Articles

    Received: Jun. 7, 2022

    Accepted: --

    Published Online: Nov. 25, 2022

    The Author Email: TENG Haiyun (tenghy@ihep.ac.cn)

    DOI:10.11889/j.0253-3219.2022.hjs.45.110402

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