Fig. 1. CO₂ laser patterned PMMA substrate. (a) Using excimer laser pulses (20 ns half-width) to ablate microchannels below 100 μm on PMMA^[43]; (b) 10.6 μm infrared CO₂ laser etching system^[28]

Fig. 2. CO₂ laser patterned PDMS substrate. (a) SEM image of a series of microchannels with different depths patterned on a PDMS substrate using CO₂ laser^[50]; (b) SEM image of a micro-pyramid array patterned on a PDMS substrate using femtosecond laser^[29]

Fig. 3. CO₂ laser patterned PI substrate. (a) SEM image of PI repaired by CO₂ laser ablation^[54]; (b) process diagram of synthesizing LIG on PI and corresponding patterned SEM image^[30]; (c) LIG activation edge SEM image Cs-STEM image, scale bar is 2 nm^[56]

Fig. 4. Laser patterned silicon substrate. (a) SEM image of nm-level trenches etched by ultraviolet laser^[32]; (b) schematic diagram of femtosecond pulse laser-induced plasma etching equipment^[58]; (c) cross-sectional STEM image of silicon near surface, no signs of laser-induced damage^[58]

Fig. 5. Femtosecond laser patterned glass substrate^[62]. (a) Optical image of 53 μm diameter TGV array etched by laser induction; (b) corresponding cross-sectional optical image of TGV

Fig. 6. SEM images of alµmina substrates cut using laser etching at different cutting speeds (the left is top view, the right is bottom view)^[35]. (a) Cutting at speed of 0.2 mm/s; (b) cutting at speed of 1.5 mm/s

Fig. 7. Laser processing TGV-Micro-LED^[69]. (a) Top-emitting micro-LED, using TGV interconnection to achieve interconnection on both sides of AB; (b) cross-sectional view of TGV blind hole with diameter of 70 µm

Fig. 8. Laser processing of 3D-TGV capacitors^[70]. (a) SEM top view of 3D-TGV capacitor; (b) TGV cross-section with diameter of 80 μm; (c) TGV cross section after copper electroplating

Fig. 9. Laser processing TGV-accelerometer^[71]. (a) Physical image of accelerometer wafer packaged in 3D-TGV wafer; (b) TGV electrical interconnection flow chart

Fig. 10. TGV-integrated antenna^[72].(a) Perspective view; (b) top view

Fig. 11. Surface corresponding to the physical image of laser patterned PDMS-TENG and the SEM image of the surface microstructure^[77]

Fig. 12. Photograph of large-scale laser patterned dielectric layer array and SEM image of micro-pyramid array^[29]

Fig. 13. Laser processing of microneedle electrode arrays^[78]. (a) Optical image and partial enlargement of the microneedle electrode array on the glass substrate; (b) side view microscopic image of gel-assisted etching of the copper hard mask at the microneedle tip; (c) select SEM image of the Au-coated microneedle tip after electrochemically etching the tip parylene coating; (d) SEM image of the microneedle tip after electrochemically depositing PtB on the tip

Fig. 14. Laser processing to manufacture LIG temperature sensors^[79].(a) Physical image of LIG temperature sensor; (b) LIG temperature sensor processing flow chart

Fig. 15. Laser processing of open microfluidic devices^[81]. (a) Schematic cross-section of the assembled open microfluidic device; (b) top view of the fabricated device from the side with its annular liquid guide and matching PMMA cover

Fig. 16. CO₂ laser fabrication of microfluidic devices for droplet generation^[82]. (a) Using CO₂ laser engraving to develop microchannels and fabricate microfluidic devices for droplet generation; (b) optical microscope and SEM images of microchannel morphology

Fig. 17. Femtosecond laser processing to fabricate fused silica resonators. (a) Ablation SEM image of a hemispheric fused silica resonator and substrate after ablation separation using femtosecond laser^[86]; (b) SEM image of a fused silica resonator fabricated using laser-induced combined chemical etching^[34]

Fig. 18. Laser cutting aluminum oxide^[89]. (a) Cross-sectional image obtained by combining Nd∶YAG laser and CO₂ laser; (b) fracture surface roughness profile

Fig. 19. Liquid-assisted laser processing of silicon carbide through holes^[90]. (a) Image of silicon carbide through holes processed by liquid-assisted laser processing; (b) relationship between through hole diameter and laser energy processed in air and water