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Acta Optica Sinica, Volume. 44, Issue 13, 1304001(2024)

High-Speed, High-Power Balanced Photodiodes Based on Flip-Chip Bonding

Ziyun Wang, Xiaojun Xie*, Chao Wei, Wei Pan, and Lianshan Yan
Author Affiliations
  • School of Information Science and Technology, Southwest Jiaotong University, Chengdu 611756, Sichuan , China
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    Article index updated: Mar. 10, 2025

    The article is cited by 2 article(s) CLP online library. (Some content might be in Chinese.)
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    Ziyun Wang, Xiaojun Xie, Chao Wei, Wei Pan, Lianshan Yan. High-Speed, High-Power Balanced Photodiodes Based on Flip-Chip Bonding[J]. Acta Optica Sinica, 2024, 44(13): 1304001

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    Paper Information

    Category: Detectors

    Received: Feb. 27, 2024

    Accepted: Apr. 11, 2024

    Published Online: Jul. 17, 2024

    The Author Email: Xie Xiaojun (xxie@swjtu.edu.cn)

    DOI:10.3788/AOS240660

    CSTR:32393.14.AOS240660

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology