Fig. 1. Schematic of the experimental setup

Fig. 2. Stability of the laser system. (a) Repetition frequency stability, the left inset is the mode locked pulse train at 20 MHz repetition rate, and the right inset shows 8 pulses in a single pulse train at 100 kHz repetition rate; (b) power stability

Fig. 3. (a) Schematic for dicing; (b) schematic for splitting

Fig. 4. Extrinsic feature of chips diced at different average power. (a) 0.27 W; (b) 0.32 W; (c) 0.4 W; (d) 0.5 W

Fig. 5. Extrinsic feature of chips diced by laser with different spot roundness. (a) Less than 80%; (b) about 85%; (c) more than 95%

Fig. 6. Cross sections of chips diced with different number of pulses. (a) 2 pulses; (b) 4 pulses; (c) 6 pulses