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Electronics and Packaging, Volume. 25, Issue 7, 70202(2025)

Research on BGA Solder Ball Isolation Performance in 3D SiP Module

CAI Mao1,2, XU Yong3, HONG Yu3, and MAO Zhonghu3
Author Affiliations
  • 1School of Electronic Science and Engineering, University of Electronic Science and Technology, Chengdu 610097, China
  • 2China Electronics Technology Group Corporation No.12 Research Institute, Beijing 100016, China
  • 3Nanjing Electronic Devices Research Institute, Nanjing 210016, China
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    [19] [19] GAO L, WEI X C, HUANG Y T, et al. Notice of retraction: analysis of near-field shielding effectiveness for the SiP module[J]. IEEE Transactions on Electromagnetic Compatibility, 2018, 60(1): 288-291.

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    CAI Mao, XU Yong, HONG Yu, MAO Zhonghu. Research on BGA Solder Ball Isolation Performance in 3D SiP Module[J]. Electronics and Packaging, 2025, 25(7): 70202

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    Paper Information

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    Received: Dec. 30, 2024

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email:

    DOI:10.16257/j.cnki.1681-1070.2025.0154

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