Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Electronics and Packaging, Volume. 25, Issue 7, 70202(2025)

Research on BGA Solder Ball Isolation Performance in 3D SiP Module

CAI Mao1,2, XU Yong3, HONG Yu3, and MAO Zhonghu3
Author Affiliations
  • 1School of Electronic Science and Engineering, University of Electronic Science and Technology, Chengdu 610097, China
  • 2China Electronics Technology Group Corporation No.12 Research Institute, Beijing 100016, China
  • 3Nanjing Electronic Devices Research Institute, Nanjing 210016, China
    • show less
    AbstractGet PDF
    Figures&Tables (0)
    Equations (0)
    References (1)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    CAI Mao, XU Yong, HONG Yu, MAO Zhonghu. Research on BGA Solder Ball Isolation Performance in 3D SiP Module[J]. Electronics and Packaging, 2025, 25(7): 70202

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category:

    Received: Dec. 30, 2024

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email:

    DOI:10.16257/j.cnki.1681-1070.2025.0154

    Topics