[1] Camps I, González J C, Sánchez M. Calculation of the thermal resistance and temperature distribution in blue‑green semiconductor lasers[J]. Semiconductor Science and Technology, 12, 1574(1997).

[2] Du L, Hu W B. An overview of heat transfer enhancement methods in microchannel heat sinks[J]. Chemical Engineering Science, 280, 119081(2023).

[3] Yan K, Zhang C, Chen X B et al. Design of temperature model predictive control for semiconductor lasers in laser soft soldering system[J]. Acta Optica Sinica, 44, 1414001(2024).

[4] Zhao Q H, Xin D, Gong K et al. 976 nm external cavity diode laser with high beam quality and narrow linewidth[J]. Laser & Optoelectronics Progress, 62, 1514006(2025).

[5] Zhu Z, Xiao C F, Xia W et al. Design and fabrication of high power 640 nm red laser diodes[J]. Laser & Optoelectronics Progress, 55, 081403(2018).

[6] Du Z C, Zhang Y J, Zhang W T et al. Review and prospect of SiC device packaging[J]. Electronics & Packaging, 22, 14-20(2022).

[7] Tang Z Y, Tang X Y, Zhang Y M et al. 4H-SiC integrated circuits for high-temperature applications[J]. Journal of Crystal Growth, 605, 127060(2023).

[8] Fu S, Yue Y F, Zeng Z L et al. Research on the process and mechanism of femtosecond laser polishing of 4H-SiC substrates[J]. Laser & Optoelectronics Progress, 63, 0114004(2026).

[9] Kim J G, Kim Y H, Lee K M et al. Changes in thermal conductivity and bandgap of SiC single crystals in accordance with thermal stress[J]. Thermochimica Acta, 542, 6-10(2012).

[10] Smowton P M, Lewis G M, Yin M et al. 650-nm lasers with narrow far-field divergence with integrated optical mode expansion layers[J]. IEEE Journal of Selected Topics in Quantum Electronics, 5, 735-739(1999).

[11] Hu X Y, Xie H Q, Zhu H J et al. Simulation and optimization of composite structures in a slab laser amplifier microchannel heat sinks[J]. Laser & Optoelectronics Progress, 62, 2114005(2025).

[12] Xia W, Zhu Z, Li X Y et al. Improved thermal performance of 640 nm laser diode packaged by SiC submount[J]. Journal of Russian Laser Research, 40, 193-196(2019).

[13] Ni Y X, Jing H Q, Kong J X et al. Thermal performance of high-power laser diodes packaged by SiC ceramic submount[J]. Chinese Journal of Lasers, 45, 0101002(2018).