Laser & Optoelectronics Progress, Volume. 60, Issue 11, 1106014(2023)

Research Progress of Novel Metasurface Spectral Imaging Chips

Tingting Wang1,2、*, Hongxing Cai1,2、**, Shuang Li1,2, Yu Ren1,2, Jing Shi1,2, Jianwei Zhou1,2, Dongliang Li1,2, Shuangshuang Ding1,2, Yangyang Hua1,2, and Guannan Qu1,2
Author Affiliations
  • 1School of physics, Changchun University of Science and Technology, Changchun 130022, Jilin, China
  • 2Key laboratory of Jilin Province for Spectral Detection Science and Technology, Changchun University of Science and Technology, Changchun 130022, Jilin, China
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    Figures & Tables(9)
    Localized coordinate system for unit structure
    Folded metasurface-based imager[49]. (a) Design scheme; (b) spectral imaging system; (c) light transmission and device fabrication
    Metasurface-based nanocavity[50]. (a) Structural design; (b) principle comparison; (c) imaging effect
    Pixelated metasurfaces[51]
    Photonic crystal slab-based computationally reconstructive imaging spectroscopy chip[52]. (a) Schematic and optical images of the chip-scale spectrometer and transmission spectra of the filtered structures; (b) verification results of hyperspectral imaging and spatial maps of the reconstructed data cubes
    Metasurface-based hyperspectral imaging chip[53]
    Freeform shaped meta-atoms-based metasurface spectroscopy imaging chip[54]
    Imaging spectral chip based on metasurface computational reconstruction technology. (a) Structure of I-type metal metasurface; (b) chip structure
    Comparison of low-light imaging effects
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    Tingting Wang, Hongxing Cai, Shuang Li, Yu Ren, Jing Shi, Jianwei Zhou, Dongliang Li, Shuangshuang Ding, Yangyang Hua, Guannan Qu. Research Progress of Novel Metasurface Spectral Imaging Chips[J]. Laser & Optoelectronics Progress, 2023, 60(11): 1106014

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    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Apr. 8, 2023

    Accepted: May. 11, 2023

    Published Online: Jun. 14, 2023

    The Author Email: Tingting Wang (ttwang@cust.edu.cn), Hongxing Cai (caihx@cust.edu.cn)

    DOI:10.3788/LOP231244

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