Research Progress of Novel Metasurface Spectral Imaging Chips

Tingting Wang; Hongxing Cai; Shuang Li; Yu Ren; Jing Shi; Jianwei Zhou; Dongliang Li; Shuangshuang Ding; Yangyang Hua; Guannan Qu

doi:10.3788/LOP231244

Laser & Optoelectronics Progress, Volume. 60, Issue 11, 1106014(2023)

Research Progress of Novel Metasurface Spectral Imaging Chips

Tingting Wang^1,2、*, Hongxing Cai^1,2、**, Shuang Li^1,2, Yu Ren^1,2, Jing Shi^1,2, Jianwei Zhou^1,2, Dongliang Li^1,2, Shuangshuang Ding^1,2, Yangyang Hua^1,2, and Guannan Qu^1,2

Author Affiliations

¹School of physics, Changchun University of Science and Technology, Changchun 130022, Jilin, China

²Key laboratory of Jilin Province for Spectral Detection Science and Technology, Changchun University of Science and Technology, Changchun 130022, Jilin, China

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Tingting Wang, Hongxing Cai, Shuang Li, Yu Ren, Jing Shi, Jianwei Zhou, Dongliang Li, Shuangshuang Ding, Yangyang Hua, Guannan Qu. Research Progress of Novel Metasurface Spectral Imaging Chips[J]. Laser & Optoelectronics Progress, 2023, 60(11): 1106014

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Paper Information

Category: Fiber Optics and Optical Communications

Received: Apr. 8, 2023

Accepted: May. 11, 2023

Published Online: Jun. 14, 2023

The Author Email: Tingting Wang (ttwang@cust.edu.cn), Hongxing Cai (caihx@cust.edu.cn)

DOI:10.3788/LOP231244

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology