APPLIED LASER, Volume. 43, Issue 5, 70(2023)
Research on the Process of Marking DM Code on Silicon Wafer by 355 nm UV Laser
References(3)
[1] [1] CHENG J, LIU C S, SHANG S, et al. A review of ultrafast laser materials micromachining［J］. Optics & Laser Technology, 2013, 46: 88-102.
[8] [8] WHITE R M. Generation of elastic waves by transient surface heating［J］. Journal of Applied Physics, 1963, 34(12): 3559-3567.
[13] [13] NORTH AMERICAN TRACEABILITY COMMITTEE. Specification for back surface marking of double-side polished wafers with a two-dimensional matrix code symbol:SEMI T7-0997［S］.CA: North American Traceability Committee,1999.
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Chen Yuan, Zhang Lingling, Li Guoqi, Du Yuanchao, Shu Tianjiao, Wu Yang. Research on the Process of Marking DM Code on Silicon Wafer by 355 nm UV Laser[J]. APPLIED LASER, 2023, 43(5): 70
Paper Information
Received: Feb. 24, 2022
Accepted: --
Published Online: Feb. 2, 2024
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