[1] Huang Ren-Bin, Zhan Dao-Hua, Yang Xiu-Ding et al. ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding[J]. Micromachines, 14(2023).

[2] LI Ke, WU Zhong-Qing, JI Yong et al. Detection method of weld bubble defect in chip X-ray image based on improved U-Net network[J]. Journal of Huazhong University of Science and Technology(Natural Science Edition)., 50, 104-110(2022).

[3] Xu Zhen-Song, Shi Tie-Lin, Lu Xiang-Ning et al. Using active thermography for defects inspection of flip chip[J]. Microelectronics Reliability, 54(2014).

[4] ZHANG Jia, LU Xing-Hua, ZHU Zhen-Yu et al. Line laser lock-in thermal maging detection of defects in multi-channel digital integrated chips[J]. Laser Journal, 43, 76-80(2022).

[5] Yu Xiao-Nan, Huang Hai-Run, Xie Wan-Long et al. Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound[J]. Applied Sciences, 10(2020).

[6] Kμmar Anubhav Tiwari , Raisutis Renaldas. Intelligent diagnosis of flip chip solder bμmps using high-frequency ultrasound and a naive Bayes classifier[J]. INSIGHT, 60(2018).

[7] Tan Shi-Hong. High-frequency Ultrasonic Detection Method for Flip Chip Defects based on Sparse Representation[D](2022).

[8] Lan Yin Lee, Kok Keng Chua . Enhanced Package Fault Isolation Method Using Time Domain Reflectometry (TDR) Incorporation with Mathematics[C], 1-3(2019).

[9] MU Qing-Yi, ZHENG Jian-Guo, YU Yong-Tang et al. In-situ evaluation of collapsible loess through time-domain reflectometry[J]. Chinese Journal of Geotechnical Engineering., 44, 1115-1123(2022).

[10] Ping Lin Chih, Yin Jeh Ngui, Hung Lin Chun. Multiple reflection analysis of TDR signal for complex dielectric spectroscopy[J]. IEEE Transactions on Instrμmentation and Measurement, 67, 2649-2661(2018).

[11] Okada T., Nishina S., Ataka T., Hashimoto M., Irisawa A., Imamura M.. Development of terahertz pulse time-domain reflectometry system for transmission line failure analysis[C], 1-2(2015).

[12] DU Hai-Wei, ZHU Si-Yuan, LV Jin et al. Research Progress of Terahertz Air Coherent Detection Technique[J]. Infrared., 41, 1-10(2020).

[13] WANG Yu-Ye, JIANG Bo-Zhou, XU De-Gang et al. Continuous Terahertz Wave Biological Tissue lmaging Technology Based on Focal Plane Array[J]. Acta Optica Sinica., 41, 74-81(2021).

[14] WU Li-Min, LIAO Bin, XU De-Gang et al. Study of in-vivo breast cancer in a subcutaneous xenograft mousemodel using terahertz imaging[J]. Journal of Infrared and Millimeter Waves., 39, 553-560(2020).

[15] Hashimoto Masaichi1, Makoto Shinohara1, Shang Yang et al. 2.5D chip TSV open failure analysis by high resolution time-domain reflectometry[J]. IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore, 1-3(2017).

[17] Saku Leena, Rahul Babu Radhamony , Soriano Andrea et al. Time-Domain Reflectometry Analysis on Low Impedance Marginal Failure and multi-chip Modules[C], 829-832(2022).

[18] Yang Shang, Shinohara Makoto, Kato Eiji et al. Defect Identification in Branched Traces by High-resolution Time-domain Reflectometry[C], 1-7(2022).

[19] TANG Peng-Fei. Research and Implementation of Dual Channel Differential TDR Waveform Processing Technology[D](2020).

[22] WANG Li-Cong, YANG Xiao-Ming, DING Yong et al. Design of a Kind of Wavequide-to-microstrip Transition with the Wider Bandwidth and the Lower lnsertion Loss[J]. Guidance & Fuze., 38, 24-28(2017).