Journal of Infrared and Millimeter Waves, Volume. 43, Issue 3, 1(2024)
Metal microstrip line defect detection of chip based on THz-TDR technology
Fig. 1. Experimental sample diagram:(a) Sample design drawings;(b) Physical drawings of samples;(c) Cross-sectional view of the sample
Fig. 2. Time domain reflectometer reflection signals under different faults
Fig. 3. Schematic diagram of time-domain reflection of terahertz pulses
Fig. 4. Open circuit measurement method diagram of time-domain reflectometer
Fig. 5. Reflection signal diagram of metal wire convex defect with different parameters:(a) The α is 75% of the convex defects of metal wires with different line wi dths;(b) Different proportional convex defects when the w is 15 μm
Fig. 6. Reflection signal diagram of metal wire concave defect with different parameters:(a) The α is 75% of metal wire concave defects with different line widths;(b) Different proportions of concave defects when the w is 25 μm
Fig. 7. Measurement contact mode of time domain reflectometer for bimetal wire
Fig. 8. Reflected signal diagrams of different defect types of metal wires with different line widths: (a) Different defect types when the w is 10 μm; (b) Different defect types when the w is 15 μm; (c) Different defect types when the w is 20 μm; (d) Different defect types when the w is 25 μm
Fig. 9. Reflected signal diagram with different defect ratios of the same line width:(a) 25% defect ratio; (b) 50% defect ratio; (c) 75% defect rate
Fig. 12. TDR simulation signals of convex defects:(a) Different w with same α; (b)Different α with same w
Fig. 13. TDR simulation signals of concave defects:(a) Different w with same α; (b) Different α with same w
|
|
Get Citation
Copy Citation Text
Zhen XU, De-Gang XU, Long-Hai LIU, Ji-Ning LI, Jia-Xin ZHANG, Tan WANG, Xiang REN, Xiu-Ming QIAO, Chen JIANG. Metal microstrip line defect detection of chip based on THz-TDR technology[J]. Journal of Infrared and Millimeter Waves, 2024, 43(3): 1
Category: Research Articles
Received: Sep. 7, 2023
Accepted: --
Published Online: Apr. 29, 2024
The Author Email: Ji-Ning LI (jiningli@tju.edu.cn)