Chip
Editor-in-Chief
Jun-Fa Mao
CN
31-2189/O4
ISSN
2709-4723
Frequency
Quarterly issues
A versatile optoelectronic device for ultrasensitive negative-positive pressure sensing applicationsResearch Articles
Xiaoshuai An, Sizhe Gui, Yingxin Li, Zhiqin Chu, and Kwai Hei Li
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100116
On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence charactersResearch Articles
Feifei Qin, Xueyao Lu, Xiaoxuan Wang, Chunxiang Guo, Jiaqi Wu, Xuefeng Fan, Mingming Jiang, Peng Wan, Junfeng Lu, Yongjin Wang, and Gangyi Zhu
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100115
Silicon photonic integrated wideband radio frequency self-interference cancellation chip for over-the-air in-band full-duplex communicationResearch Articles
Xinxin Su, Meng Chao, Xiuyou Han, Han Liang, Wenfu Zhang, Shuanglin Fu, Weiheng Wang, and Mingshan Zhao
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100114
III-nitride MQW-based optoelectronic sensors for multifunctional environmental monitoringResearch Articles
Xumin Gao, Dongmei Wu, Tianlong Xie, Jialei Yuan, Mingyuan Xie, Yongjin Wang, Haitao Zhao, Gangyi Zhu, and Zheng Shi
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100113
Haiqi Gao, Yu Shao, Yipeng Chen, Junren Wen, Yuchuan Shao, Yueguang Zhang, Weidong Shen, and Chenying Yang
Jan. 23, 2025Chip
DOI：10.1016/j.chip.2024.100112
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Challenges and recent advances in HfO2-based ferroelectric films for non-volatile memory applications
ChipVol. 3, Issue 3, 100101 (2024)
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View fulltextRemote electric powering by germanium photovoltaic conversion of an Erbium-fiber laser beam
ChipVol. 3, Issue 3, 100099 (2024)
Colloidal semiconductor nanocrystals for light emission and photonic integration
ChipVol. 3, Issue 1, 100073 (2024)
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