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Chinese Journal of Lasers, Volume. 49, Issue 8, 0802015(2022)

Femtosecond Laser Direct Writing of Copper Microstructures with High Efficiency via Thermal Effect of Nanoparticles

Mengya Cui, Ting Huang*, and Rongshi Xiao
Author Affiliations
  • Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
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    Figures&Tables (12)
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    References (34)
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    Figures & Tables(12)
    Schematic of femtosecond laser direct writing of Cu microstructures system

    Fig. 1. Schematic of femtosecond laser direct writing of Cu microstructures system

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    OM, SEM and high-resolution SEM images of copper microstructures obtained under different intensities with a constant scanning speed of 500 mm·s－1. (a) 5.32×109 W·cm－2; (b) 6.38×109 W·cm－2; (c) 7.45×109 W·cm－2; (d) 8.51×109 W·cm－2 (the scale bars are 100 μm, 20 μm and 200 nm in OM, SEM and high-resolution SEM images, respectively)

    Fig. 2. OM, SEM and high-resolution SEM images of copper microstructures obtained under different intensities with a constant scanning speed of 500 mm·s－1. (a) 5.32×109 W·cm－2; (b) 6.38×109 W·cm－2; (c) 7.45×109 W·cm－2; (d) 8.51×109 W·cm－2 (the scale bars are 100 μm, 20 μm and 200 nm in OM, SEM and high-resolution SEM images, respectively)

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    XRD spectra of copper microstructures obtained under different intensities with a constant scanning speed of 500 mm·s－1

    Fig. 3. XRD spectra of copper microstructures obtained under different intensities with a constant scanning speed of 500 mm·s－1

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    Schematics of reduction reaction during femtosecond laser direct writing of copper microstructures. (a) Without photon-absorbing nanoparticles; (b) with photon-absorbing nanoparticles

    Fig. 4. Schematics of reduction reaction during femtosecond laser direct writing of copper microstructures. (a) Without photon-absorbing nanoparticles; (b) with photon-absorbing nanoparticles

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    OM, SEM and high-resolution SEM images of copper microstructures obtained under different scanning speeds with a laser intensity of 5.32×109 W·cm－2. (a) 100 mm·s－1; (b) 200 mm·s－1; (c) 300 mm·s－1; (d) 400 mm·s－1 (the scale bars are 100 μm, 20 μm and 200 nm in OM, SEM and high-resolution SEM images, respectively)

    Fig. 5. OM, SEM and high-resolution SEM images of copper microstructures obtained under different scanning speeds with a laser intensity of 5.32×109 W·cm－2. (a) 100 mm·s－1; (b) 200 mm·s－1; (c) 300 mm·s－1; (d) 400 mm·s－1 (the scale bars are 100 μm, 20 μm and 200 nm in OM, SEM and high-resolution SEM images, respectively)

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    XRD spectra and proportion of each phase in copper microstructure obtained under different scanning speeds with a laser intensity of 5.32×109 W·cm－2. (a) XRD spectra; (b) proportion of each phase

    Fig. 6. XRD spectra and proportion of each phase in copper microstructure obtained under different scanning speeds with a laser intensity of 5.32×109 W·cm－2. (a) XRD spectra; (b) proportion of each phase

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    Variation of sheet resistance of copper microstructures with laser parameters. (a) Variation with scanning speed under a constant laser intensity of 5.32×109 W·cm－2; (b) variation with laser intensity at a constant scanning speed of 500 mm·s－1

    Fig. 7. Variation of sheet resistance of copper microstructures with laser parameters. (a) Variation with scanning speed under a constant laser intensity of 5.32×109 W·cm－2; (b) variation with laser intensity at a constant scanning speed of 500 mm·s－1

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    Three-dimensional morphologies of copper microstructures prepared by femtosecond laser direct writing under different scanning speeds with a constant laser intensity of 5.32×109 W·cm－2. (a) 400 mm·s－1; (b) 300 mm·s－1; (c) 200 mm·s－1; (d) 100 mm·s－1.

    Fig. 8. Three-dimensional morphologies of copper microstructures prepared by femtosecond laser direct writing under different scanning speeds with a constant laser intensity of 5.32×109 W·cm－2. (a) 400 mm·s－1; (b) 300 mm·s－1; (c) 200 mm·s－1; (d) 100 mm·s－1.

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    Schematic of threshold effect during femtosecond laser direct writing of copper microstructures

    Fig. 9. Schematic of threshold effect during femtosecond laser direct writing of copper microstructures

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    Digital images of two-dimensional Cu film pattern prepared using femtosecond laser direct writing. (a) Square pattern with size of 10 mm×10 mm; (b) Tai Chi pattern

    Fig. 10. Digital images of two-dimensional Cu film pattern prepared using femtosecond laser direct writing. (a) Square pattern with size of 10 mm×10 mm; (b) Tai Chi pattern

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    • Table 1. Comparison of direct writing efficiency of femtosecond laser direct writing of Cu microstructures

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      Table 1. Comparison of direct writing efficiency of femtosecond laser direct writing of Cu microstructures

      MethodMax. scanning speed /(mm·s－1)Max. line width /μmThickness /μmWriting efficiency /(μm3·s－1)
      Method in Ref. [27]5～300.64 (glass substrate)9.6×104
      10～501.7 (PDMS substrate)8.5×105
      Method in Ref. [28]8～572.8×105
      Method in Ref. [29]5～40<61.2×106
      Method in Ref. [25]1～200.61.2×104
      Our method500 (repeated 50 times)225～173.83×107

    • Table 2. Sheet resistivity, thickness, and electrical resistivity of femtosecond laser direct written Cu microstructures at different scanning speeds

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      Table 2. Sheet resistivity, thickness, and electrical resistivity of femtosecond laser direct written Cu microstructures at different scanning speeds

      Scanning speed /(mm·s－1)Sheet resistance /(Ω·sq－1)Thickness / μmElectrical resistivity /(Ω·m)
      1000.28±0.0116.92±5.454.67×10－6
      2000.83±0.2211.83±2.749.82×10－6
      3009.26±1.0710.79±1.839.98×10－5
      40070.90±7.475.99±3.794.25×10－4
      500>0.5×106  
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    Mengya Cui, Ting Huang, Rongshi Xiao. Femtosecond Laser Direct Writing of Copper Microstructures with High Efficiency via Thermal Effect of Nanoparticles[J]. Chinese Journal of Lasers, 2022, 49(8): 0802015

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    Paper Information

    Category: laser manufacturing

    Received: Aug. 27, 2021

    Accepted: Oct. 21, 2021

    Published Online: Mar. 23, 2022

    The Author Email: Ting Huang (huangting@bjut.edu.cn)

    DOI:10.3788/CJL202249.0802015

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology