Laser & Infrared, Volume. 54, Issue 3, 340(2024)
Thermal simulation analysis for slab laser amplifier based on microchannel heat sink
[4] [4] Tuckerman D B, Pease R. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters, 1981, 2(5): 126-129.
[5] [5] Harpole G M, Eninger J E. Micro-channel heat exchanger optimization[J]. Semiconductor Thermal Measurement & Management Symposium. IEEE, 2002, 3(7): 59-63.
[6] [6] Crump P A, Crum T R, DeVito M, et al. High efficiency, high power 808 nm laser array and stacked arrays optimized for elevated temperature operation[J]. Ome Information, 2004(6): 1-11.
[9] [9] Jing H, Zhong L, Ni Y, et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. Journal of Semiconductors, 2015, 36(10): 37-42.
[14] [14] DUAN Z P, MA H, HE B S, et al. Pressure drop of microchannel plate fin heat sinks[J]. Micromachines, 2019, 10(2).
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WU Di, YU Yu, LI Kai, YU Heng-zhe, XU Zhi-peng, LI Yun-fei, WANG Gong, BAI Zhen-xu, WANG Xi, WANG Jun-guang, ZHANG Yong-ning, WANG Bi-yi, WANG Yu-lei, LV Zhi-wei. Thermal simulation analysis for slab laser amplifier based on microchannel heat sink[J]. Laser & Infrared, 2024, 54(3): 340
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Received: Jun. 27, 2023
Accepted: Jun. 4, 2025
Published Online: Jun. 4, 2025
The Author Email: YU Yu (yuyu1990@hebut.edu.cn)