A metal bonding technology was proposed for Au-Au thin films under atmospheric and low temperature conditions. And the effect of activation treatment time on the surface roughness of Au-Au films， the bonding quality and reliability of Au-Au films were studied. The experimental results showed that the surface roughness of the Au film first decreased and then increased with the increase of the surface activation treatment time. When the surface activation treatment time reached 20 min， the root mean square of the surface roughness of the Au film was 6.9 nm， the number of dangling bonds and the roughness could achieve a relatively balanced relationship， the average shear strength of the Au-Au film after bonding was 131.8 MPa， and the maximum shear strength was as high as 159.1 MPa. Therefore， the ideal surface activation treatment time of Au film surface could effectively improve the bonding quality and stability of Au-Au film， and provide theoretical guidance for the realization of low-temperature metal bonding of hybrid integrated Micro-LED devices.