Laser & Optoelectronics Progress, Volume. 60, Issue 17, 1714005(2023)
Study on Process and Quality of Dual Laser Etching and Cleaning Flexible Copper Clad Laminate
Figures & Tables(14)
Fig. 3. FCCL first-order blind hole machining schematic. (a) Schematic diagram of copper foil etching by nanosecond laser concentric scanning method; (b) copper foil layer etching profile; (c) schematic diagram of spiral scanning method of etching and cleaning blind hole; (d) schematic diagram of the first-order blind hole section
Fig. 4. Laser etched copper layer morphology. (a) Radius measurement chart under optical microscope; (b) three-dimensional height map under laser confocal microscope
Fig. 5. Observation diagram of laser etching and cleaning blind hole. (a) Nanosecond laser etching and cleaning morphology under optical microscope; (b) picosecond laser etching and cleaning morphology under optical microscope;(c) nanosecond laser processing blind hole two-dimensional profile; (d) picosecond laser processing blind hole two-dimensional contour diagram
Fig. 6. Optimized parameters for picosecond laser etching and cleaning of blind hole. (a) Three-dimensional color map under laser confocal microscope; (b) profile color map; (c) three-dimensional height map; (d) profile height map
Table 1. Laser processing experimental equipment parameters
View tableTable 1. Laser processing experimental equipment parameters
Item Nanosecond laser Picosecond laser Production company DCT DCT Equipment model Direct Laser S3 Direct Laser S5 Power /W 15 15 Wavelength /nm 355 355 Beam type
Pulse width /ns
Gaussian beam
20
Gaussian beam
15×10-3
Light spot diameter /μm 30 25
Table 2. Factor level table
View tableTable 2. Factor level table
Level Power /W Repetition frequency /kHz Scanning times Scanning speed /（mm·s-1） 1 3.0 80 1 700 2 3.5 90 2 800 3 4.0 100 3 900 4 4.5 110 4 1000
Table 3. Orthogonal experimental factor design and results
View tableTable 3. Orthogonal experimental factor design and results
Serial number Level Depth /µm Roughness of hole bottom /µm A B C D 1 1 1 1 1 34.42 1.78 2 1 2 2 2 34.06 1.67 3 1 3 3 3 33.87 1.12 4 1 4 4 4 33.02 1.05 5 2 1 2 3 37.45 0.76 6 2 2 1 4 35.86 1.20 7 2 3 4 1 38.43 0.87 8 2 4 3 2 37.86 0.78 9 3 1 3 4 39.04 0.98 10 3 2 4 3 39.84 1.03 11 3 3 1 2 35.66 1.20 12 3 4 2 1 37.64 0.87 13 4 1 4 2 40.76 1.20 14 4 2 3 1 39.78 1.23 15 4 3 2 4 38.24 0.88 16 4 4 1 3 35.02 1.02
Table 4. Range analysis
View tableTable 4. Range analysis
Item Level Power /W Repetition frequency /kHz Scanning times Scanning speed /（mm·s-1） Depth k1 33.84 37.92 35.24 37.57 k2 37.40 37.39 36.85 37.09 k3 38.05 36.55 37.64 36.55 k4 38.45 35.89 38.01 36.54 R 4.61 2.03 2.77 1.03 Roughness k1 1.44 1.18 1.35 1.19 k2 0.90 1.30 1.04 1.21 k3 1.03 1.05 1.06 0.99 k4 1.08 0.93 1.05 1.03 R 0.54 0.37 0.31 0.23
Table 5. Factor level table
View tableTable 5. Factor level table
Level Power /W Repetition frequency /kHz Scanning times Scanning speed /（mm·s-1） 1 3 100 4 800 2 4 120 5 900 3 5 140 6 1000 4 6 160 7 1100
Table 6. Orthogonal experimental factor design and results
View tableTable 6. Orthogonal experimental factor design and results
Serial number Level Depth /µm Roughness of hole bottom /µm A B C D 1 1 1 1 1 35.85 0.57 2 1 2 2 2 34.76 0.60 3 1 3 3 3 34.52 0.65 4 1 4 4 4 34.35 0.75 5 2 1 2 3 36.87 0.47 6 2 2 1 4 36.65 0.58 7 2 3 4 1 36.48 0.44 8 2 4 3 2 36.20 0.62 9 3 1 3 4 37.67 0.23 10 3 2 4 3 37.35 0.25 11 3 3 1 2 36.75 0.29 12 3 4 2 1 36.02 0.28 13 4 1 4 2 38.24 0.28 14 4 2 3 1 37.90 0.31 15 4 3 2 4 36.26 0.31 16 4 4 1 3 35.24 0.48
Table 7. Range analysis
View tableTable 7. Range analysis
Item Level Power /W Repetition frequency /kHz Scanning times Scanning speed /（mm·s-1） Depth k1 34.87 37.16 36.56 36.56 k2 36.55 36.67 35.98 36.49 k3 36.95 36.00 36.57 36.00 k4 36.91 35.45 36.61 36.23 R 2.08 1.71 0.63 0.56 Optimal level A3 B1 C4 D1 Roughness k1 0.64 0.39 0.48 0.4 k2 0.53 0.44 0.42 0.45 k3 0.26 0.42 0.45 0.46 k4 0.35 0.53 0.43 0.47 R 0.38 0.14 0.06 0.07 Optimal level A4 B2 C2 D1
Table 8. Optimization process etching results
View tableTable 8. Optimization process etching results
Item Depth /µm Roughness of hole bottom /µm Surface roughness /µm Nanosecond laser 37.25 0.65 0.57 Picosecond laser 37.02 0.16 0.25
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Zhihui Huang, Qike Ye, Qijiao Ye, Jianhong Liao. Study on Process and Quality of Dual Laser Etching and Cleaning Flexible Copper Clad Laminate[J]. Laser & Optoelectronics Progress, 2023, 60(17): 1714005
Paper Information
Category: Lasers and Laser Optics
Received: Aug. 1, 2022
Accepted: Sep. 5, 2022
Published Online: Sep. 13, 2023
The Author Email: Jianhong Liao (liaojh@scnu.edu)
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