Fig. 1. Processing light path

Fig. 2. Generation device and transmission process of Bessel beams. (a) Axicon and 4f system; (b) propagation of Bessel beam in different media

Fig. 3. Bessel laser ablation cutting solution. (a) Laser drilling; (b) fracturing glass by external force

Fig. 4. Gaussian laser multi-pass scanning cutting solution

Fig. 5. Schematic of kerf loss width and phase transition region width

Fig. 6. Processed cross-sections under different defocusing distances. (a) -350 μm; (b) -650 μm; (c) -800 μm; (d) -400 μm;

Fig. 7. Relationship between edge chipping size and defocusing distance

Fig. 8. Morphologies of quartz glass after cutting. (a1)‒(a3) Morphologies of surfaces; (b1)‒(b3) morphologies of edges; (c1)‒(c3) cross-section morphologies

Fig. 9. Quartz glass obtained by linear cutting and curved cutting

Fig. 10. Relationship between kerf loss width and single pulse energy

Fig. 11. Relationship between kerf loss width and overlap rate

Fig. 12. Relationship between width of phase transition region and pulse width

Fig. 13. 3D morphologies of sections under different pulse widths. (a) 4 ps; (b) 8 ps

Fig. 14. Effect of focus depth on modification effect. (a) Section of quartz glass after cutting; (b) roughness values of three regions under different pulse widths