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Chinese Journal of Lasers, Volume. 49, Issue 10, 1002404(2022)

Mechanism and Research Advances of Water-Jet Guided Laser Micromachining

Shuiwang Wang1, Ye Ding1,2、*, Bai Cheng2, Yuan Li2, and Lijun Yang1,2、**
Author Affiliations
  • 1College of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, Heilongjiang, China
  • 2Key Laboratory of Micro-Systems and Micro-Structures Manufacturing, Ministry of Education, Harbin Institute of Technology, Harbin 150001, Heilongjiang, China
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    Working principle of water-jet guided laser (WJGL) processing technology[22]

    Fig. 1. Working principle of water-jet guided laser (WJGL) processing technology[22]

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    Nozzle structures for forming jet. (a) Schematic of vena-contracta[32]; (b) cylindrical nozzle; (c) cone nozzle；(d) cone-up nozzle; (e) cone-down nozzle

    Fig. 2. Nozzle structures for forming jet. (a) Schematic of vena-contracta[32]; (b) cylindrical nozzle; (c) cone nozzle；(d) cone-up nozzle; (e) cone-down nozzle

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    Distribution of water jet. (a) Structure diagram of water jet[33]; (b) jet morphology formed by water-gas shrinkage-guided high-power laser processing technology[38]; (c) diagram of flow field of jet impinging on the plane[40]

    Fig. 3. Distribution of water jet. (a) Structure diagram of water jet[33]; (b) jet morphology formed by water-gas shrinkage-guided high-power laser processing technology[38]; (c) diagram of flow field of jet impinging on the plane[40]

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    Absorption coefficient of water for different wavelengths of lasers[41]

    Fig. 4. Absorption coefficient of water for different wavelengths of lasers[41]

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    Relationship between laser energy transmission efficiency and water beam length under different laser power densities[44]

    Fig. 5. Relationship between laser energy transmission efficiency and water beam length under different laser power densities[44]

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    Light distribution in the jet. (a) Schematic of meridian rays[49]; (b) schematic of oblique rays[49]；(c) total reflection propagation of meridian rays and oblique rays in a water jet[50]

    Fig. 6. Light distribution in the jet. (a) Schematic of meridian rays[49]; (b) schematic of oblique rays[49]；(c) total reflection propagation of meridian rays and oblique rays in a water jet[50]

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    Coupling of light and water jet. (a) Schematic of lateral error[50]; (b) schematic of vertical spacing error[50]; (c) schematic of axial angle error[50]; (d) schematic of end face angle error[50]; (e) schematic of near-field coupling[29]; (f) schematic of far-field coupling[29]; (g) schematic of end-face coupling[29]

    Fig. 7. Coupling of light and water jet. (a) Schematic of lateral error[50]; (b) schematic of vertical spacing error[50]; (c) schematic of axial angle error[50]; (d) schematic of end face angle error[50]; (e) schematic of near-field coupling[29]; (f) schematic of far-field coupling[29]; (g) schematic of end-face coupling[29]

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    Distribution of laser in water jet. (a) Intensity distribution under different numerical apertures, eccentric distances and water jet diameters[51]; (b) diagrams of test results of laser and water jet coupling under different jet diameters[53] (wavelength is 532 nm, numerical aperture is 0.665, and L epresents energy loss rate)

    Fig. 8. Distribution of laser in water jet. (a) Intensity distribution under different numerical apertures, eccentric distances and water jet diameters[51]; (b) diagrams of test results of laser and water jet coupling under different jet diameters[53] (wavelength is 532 nm, numerical aperture is 0.665, and L epresents energy loss rate)

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    Processed surface morphologies of traditional metal materials. (a) Comparison of surface morphology of stainless steel processed by electrical discharge machining (EDM) and water-jet guided laser (WJGL) cutting[55]; (b) comparison of hole edge quality of stainless steel processed by“dry laser”and WJGL[56]; (c) comparison of surface quality of aluminum, stainless steel, and brass under the same technological parameters (working distance is 90 mm)[58]

    Fig. 9. Processed surface morphologies of traditional metal materials. (a) Comparison of surface morphology of stainless steel processed by electrical discharge machining (EDM) and water-jet guided laser (WJGL) cutting[55]; (b) comparison of hole edge quality of stainless steel processed by“dry laser”and WJGL[56]; (c) comparison of surface quality of aluminum, stainless steel, and brass under the same technological parameters (working distance is 90 mm)[58]

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    Processed surface morphologies of metal materials used in aerospace field. (a) SEM images of incision cross-section of titanium alloy cut by“dry laser”and WJGL[60]; (b) detailed illustration of the“wall effect”[61]; (c) SEM images of recast layers of holes processed by“dry laser”，EDM, and WJGL processes[62]; (d) high density dislocations and cross mechanical twins under SEM[64]; (e) effect of pulse frequency on coating delamination[65]

    Fig. 10. Processed surface morphologies of metal materials used in aerospace field. (a) SEM images of incision cross-section of titanium alloy cut by“dry laser”and WJGL[60]; (b) detailed illustration of the“wall effect”[61]; (c) SEM images of recast layers of holes processed by“dry laser”，EDM, and WJGL processes[62]; (d) high density dislocations and cross mechanical twins under SEM[64]; (e) effect of pulse frequency on coating delamination[65]

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    Processing results of semiconductor materials. (a) Comparison of the front surface quality of sawn and WJGL-cut of gallium arsenide [66]; (b) comparison of cross-sectional topography of scribed silicon wafers at different feeding speeds obtained by simulation and experiment[67]; (c) temperature field and material removal simulation results obtained under different water jet thermal conductivity coefficients[68]; (d) density wave distribution after 1.65 ps at the start of processing[69]; (e)“V”-shaped cross-section obtained by scribing grooves on silicon wafer by WJGL[70]

    Fig. 11. Processing results of semiconductor materials. (a) Comparison of the front surface quality of sawn and WJGL-cut of gallium arsenide [66]; (b) comparison of cross-sectional topography of scribed silicon wafers at different feeding speeds obtained by simulation and experiment[67]; (c) temperature field and material removal simulation results obtained under different water jet thermal conductivity coefficients[68]; (d) density wave distribution after 1.65 ps at the start of processing[69]; (e)“V”-shaped cross-section obtained by scribing grooves on silicon wafer by WJGL[70]

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    Processing results of composite materials. (a) Morphology characteristics of hole section obtained by processing Al MMC with WJGL and millisecond pulse laser[72]; (b) comparison of cutting surface appearance obtained by WJGL and“dry laser”cutting CFRP[73]; (c)“rectangular scaning”and“parallel scanning”strategies and their corresponding slit morphologies[74]; (d) overall appearance of the slit after 4 mm thick CFRP processing[76]; (e) partially enlarged cross-sectional topography of CMCs processed under different gas atmospheres[39]

    Fig. 12. Processing results of composite materials. (a) Morphology characteristics of hole section obtained by processing Al MMC with WJGL and millisecond pulse laser[72]; (b) comparison of cutting surface appearance obtained by WJGL and“dry laser”cutting CFRP[73]; (c)“rectangular scaning”and“parallel scanning”strategies and their corresponding slit morphologies[74]; (d) overall appearance of the slit after 4 mm thick CFRP processing[76]; (e) partially enlarged cross-sectional topography of CMCs processed under different gas atmospheres[39]

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    • Table 1. Processing parameters and performances obtained in WJGL processing of different materials

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      Table 1. Processing parameters and performances obtained in WJGL processing of different materials

      MaterialLaser parameterWater jet parameterConclusion
      0.1 and 0.2 mm thick strips of 99% aluminum, Cu37Zn brass, and 18Cr9Ni stainless steel[54]Nd∶YAG 1064 nm, 105 W, 100 μs, 300 HzJet diameter：120 μm；water pressure：20 MPaFor 1064 nm laser, 50 mm is a reliable working distance. Due to the difference in reaction mode and melting point, the recast layer of copper is thick
      2 mm thick C263 coated with a 300 μm thick TBC and 100 μm thick BC[65]Nd∶YAG 535 nm, 42 W, 200 ns, 624 kHzJet diameter：60 μm；water pressure：30 MPaThe increase of the pulse frequency reduces the heat accumulation between the coating and the substrate. When the frequency is 6 kHz and the spiral track is 150 times, the surface of the processed hole is smooth and there is no thermal damage
      Inconel 718 ( size：100 mm×6 mm×6 mm)[64]Synova MCS 300 532 nm, 90 W，250 ns, 12 kHzNozzle diameter：50 μm；water pressure：40 MPaThe expanded high-pressure plasma plume produces shock waves on the substrate, forming mechanical twins, and the mechanical twins arranged in different directions intersect each other to form sub-micron diamond-shaped blocks
      CFRP[73]AWAVE UV 355 nm, 10 W，20 ns, 30 kHzJet diameter：150 μm water pressure：6 MPaSome stripes of WJGL processed specimens tend to be perpendicular to CFRP. The inner surface is clean, without melting and splashing adhesion, but the processing efficiency is relatively low
      CFRP[76]532 nm, 10/15/20/25/30 W，8.650.3 ns，40 kHzJet diameter：100 μm water pressure：5 MPaWith the increase of laser power, the cutting depth gradually increases, while the gap width does not change significantly, and it can achieve high-efficiency cutting of 10 mm thick CFRP
      Al MMC[72]3-axis Synova MCS 300 535 nm, 60 W，200 ns, 800 HzNozzle diameter：60 μm；water pressure：30 MPaIt takes up to 12 s to drill a 0.8 mm hole in a 2 mm thick Al MMC, and the drilling quality fully meets the requirements of the aerospace industry
      CMCs[39]PR-532-25-A 532 nm, 25 W，20 ns, 30 kHzNozzle diameter：100 μm；water pressure：20 MPaThe coaxial spiral argon atmosphere increases the stable length of the jet and effectively inhibits the formation of the recast layer. The cross-section of the processing zone is uniform, without silicon carbide fiber stretching and delamination
      Monocrystalline silicon (size: 10 mm×10 mm×1 mm)[70]Nd∶DPSS laser system 532 nm, 025 W, 300 ns，20120 kHz

      Jet diameter：60 μm

      water pressure：70 MPa

      		Ablation depth increases with the increase of power and decreases with the increase of repetition frequency. The higher the repetition frequency, the rougher the cutting surface. Ablation depth and width decrease with the increase of cutting speed
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    Shuiwang Wang, Ye Ding, Bai Cheng, Yuan Li, Lijun Yang. Mechanism and Research Advances of Water-Jet Guided Laser Micromachining[J]. Chinese Journal of Lasers, 2022, 49(10): 1002404

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    Paper Information

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    Received: Nov. 11, 2021

    Accepted: Dec. 22, 2021

    Published Online: May. 9, 2022

    The Author Email: Ding Ye (dy1992hit@hit.edu.cn), Yang Lijun (yljtj@hit.edu.cn)

    DOI:10.3788/CJL202249.1002404

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology