Journal of Infrared and Millimeter Waves, Volume. 42, Issue 2, 197(2023)

A 33~170 GHz cascode amplifier based on InP DHBT technology

Bo-Wu WANG1, Wei-Hua YU1,2, Yan-Fei HOU3, Qin YU1, Yan SUN4, Wei CHENG4, and Ming ZHOU4、*
Author Affiliations
  • 1Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, Beijing Institute of Technology, Beijing 100081, China
  • 2BIT Chongqing Institute of Microelectronics and Microsystems, Chongqing 400031, China
  • 3Beijing Institute of Radio Measurement, Beijing 100039, China
  • 4Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, Nanjing 210016, China
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    In this paper, a wide band cascode power amplifier working at 33~170 GHz is designed, based on the 500 nm InP dual-heterojunction bipolar transistor (DHBT) process. Two pairs of parallel input and output stub lines can effectively expand the working bandwidth. The output coupling line compensates the high frequency transmission. The measured results show that the maximum gain of the amplifier is 11.98 dB at 115 GHz, the relative bandwidth is 134.98 %, the gain flatness is ±2 dB, the gain is better than 10 dB and the output power is better than 1 dBm in the operating bandwidth.

    Keywords

    Introduction

    With the increasing demand for high data rate and high resolution,it is foreseeable that millimeter wave radar,imaging and communication systems will become are widely applied 1-3. But at higher frequencies,the achievable gain of tunable amplifiers is low,while distributed amplifiers inherently have wider bandwidths. Therefore the distributed topology is an important way to realize the wide band amplifier. In addition,the cascode amplifier structure also has wide band characteristics and can be used as a basic unit to form a distributed amplifier. The reported cascode amplifiers cover the DC-110 GHz4,110~170 GHz5-6,and 140~250 GHz7 frequency bands,however,designers always have to make a trade-off between bandwidth and gain.

    In this paper,an ultra-wideband cascode amplifier operating at 33~170 GHz is demonstrated. The proposed amplifier can achieve 134.98% relative bandwidth and maintain a gain flatness of ±2 dB,with the small signal gain better than 10 dB and the output power better than 1 dBm over the operating bandwidth.

    1 InP DHBT technology

    The monolithic microwave integrated circuit(MMIC)was fabricated based on 500-nm dual-heterojunction bipolar transistor(DHBT)process on 3 inch semi-insulating InP substrate using molecular-beam epitaxy(MBE)manufactured by Nanjing Electronic Devices Institute. An InGaAsP composite collector was used to eliminate the current blocking effect caused by the B-C heterojunction conduction band spike8. The composite collector area consist of an InGaAs layer,a step-graded InGaAsP layer,and a δ-doping layer,all the layer structures are listed in Table I9-10. The width of emitter contact is 500 nm,and two 300 nm wide base contacts at its both side. A transit frequency of 300 GHz and a maximum oscillation frequency above 400 GHz are extracted,as shown in Fig. 1. The process provides three wiring metal layers and compact interconnect vias between them. The MIM capacitor with 0.26 fF/µm2 capacitance density and 25 Ω/square TaN TFR are also available11.

    • Table 1. Layer structure of the InGaAs/InP DHBT

      Table 1. Layer structure of the InGaAs/InP DHBT

      LayerMaterialThickness/nmDopant
      InP substrate100 µmS.I.
      Emitter contactInGaAs200Si
      EmitterInP200Si
      BaseInGaAs35C
      Setback layerInGaAs30Si
      Step-gradedInGaAsP50Si
      δ-dopingInP5Si
      CollectorInP150Si
      Collector contactInGaAs50Si
      Sub-collectorInP200Si

    The fT and fmaxof the transistor

    Figure 1.The fT and fmaxof the transistor

    The schematic diagram of the multilayer integrated circuit process used in this paper is shown in Fig. 2. The thickness of the metal layer and corresponding BCB layer are all on the order of 1μm12. Each layer of metal can be used as a signal line or a common ground layer. However,when M2 or M3 is used as the ground,the interconnection structures are more complicated and will bring more parasitic mode effects. Therefore,M1 is used as the common ground,in which case only the windows around the series capacitors are opened that will greatly reduce the leak area13. Thin-film micro-strip lines(TFMLs)can be realized with M1 as ground and M3 for signal line shown in Fig. 2(b). The effective dielectric thickness is only a few micro-meters,and for a 50 ohm TFML,its line width is almost 12 μm in the band of 1~300 GHz14.

    Schematic cross-sectional view of (a) multilayer interconnect, and (b) thin-film microstrip lines

    Figure 2.Schematic cross-sectional view of (a) multilayer interconnect, and (b) thin-film microstrip lines

    2 Circuit design

    Figure 3 shows the block diagram of a typical cascode amplifier. The common-emitter(CE)HBT produces the controlled output current,this controlled current flows into the common-base(CB)HBT and is buffered by the(CB)HBT. The buffer effect reduces the output resistance of(CE)HBT and reduce the voltage gain of(CE)HBT,which in turn reduces the Miller effect. Such structure has the benefits of better gain while maintaining good linearity and reverse isolation.

    Block diagram of the typical cascode amplifier

    Figure 3.Block diagram of the typical cascode amplifier

    Figure 4 shows the circuit topology for the designed cascode amplifier. In order to obtain wide bandwidth,two pair parallel open-ended stubs were respectively added to the input matching networks of the first stage(CE)HBT and the output matching networks of the second stage(CB)HBT. One pair of stubs is designed at the higher frequency band,and the other pair is designed at the lower frequency band. Figure 5 shows the amplifier’s optimum power input and output impedance matching network schematics. This makes a trade-off between bandwidth and gain of the amplifier. The folded coupling lines act as parts of matching network while compensating some high frequency transmission loss. An impedance matching line with a width of 20 µm and a length of 250 µm was introduced between the two HBT devices. Since both(CE)HBT and(CB)HBT are supplied by Vc,then the stability of the cascode amplifier is sensitive to the current(the controlled CE output current)passing through the inter-stage matching line. Figure 6 shows this chip photograph of the cascode amplifier MMIC. The size is 1.0 mm × 0.8 mm.

    Circuit topology for the wide band cascode amplifier

    Figure 4.Circuit topology for the wide band cascode amplifier

    Impedance matching Smith chart and the network schematic

    Figure 5.Impedance matching Smith chart and the network schematic

    Chip photograph of the cascode amplifier MMIC. Size:1.0 mm × 0.8 mm

    Figure 6.Chip photograph of the cascode amplifier MMIC. Size:1.0 mm × 0.8 mm

    3 On-wafer measurement

    Characterization of the MMIC cascode amplifiers were obtained by on-wafer measurements. The measured results are shown in Fig. 7 and Fig. 8. The S-parameter measurements were performed using a Keysight PNA-X N5247B network analyzer with Keysight N5293AX01(1~110 GHz)frequency extenders,and Rohde & Schwarz ZVA50 network analyzer with Rohde & Schwarz ZC170(110~170 GHz)frequency extenders.

    Measured and simulated S-parameters of the broadband amplifier MMIC On-wafer bias:Vb1=1.5 V,Vb2/Vc=2.5 V

    Figure 7.Measured and simulated S-parameters of the broadband amplifier MMIC On-wafer bias:Vb1=1.5 V,Vb2/Vc=2.5 V

    Output power measured results

    Figure 8.Output power measured results

    The measured results show that the maximum gain of the amplifier at 115 GHz is 11.98 dB,and the 3 dB bandwidth is 33 to 170 GHz(134.98%). Figure 7 also shows the simulation results of no stub or matched impedance line. Through comparison,it can be found that these stubs and matching lines can effectively increase the amplifier bandwidth. Signal fluctuations in the range of 65~85 GHz and 100~110 GHz are large,which is caused by overheating of the frequency extender modules for a long time. The spectrum spurs can be reduced by turning off the system and cooling,but it cannot be completely eliminated. The saturated output power of the device is 1.8 dBm at 117 GHz,when the input power is -5 dBm. The output power is better than 1 dBm in the range of 35~134 GHz,and greater than 0 dBm in the range of 41~170 GHz,as shown in Fig. 7. Accordingly,the output collector current is 5 mA at 2.5V supply and the peak power added efficiency(PAE)is 8.8%.

    • Table 2. State-of-the-art of ultra-broadband amplifier

      Table 2. State-of-the-art of ultra-broadband amplifier

      Ref.. f/GHzTechnologyGain /dBGain Flatness/dBTopology/ DevicesChip-size /mm2Pout/dBm
      140~185500 nm InP DHBT10±2

      Distributed

      ×10

      0.8×0.7510
      40~110100 nm GaAs pHEMT6±2.5

      Cascode

      ×2

      --
      5123~143130 nm SiGe BiCMOS24.3-

      Cascode

      ×10

      0.7×0.437.7
      6110~170SiGe BiCMOS10.8±2.5

      Cascode

      ×2

      0.035-
      7118~23635 nm GaAs mHEMT10-

      Cascode

      ×8

      1.5×0.510
      This work33~170

      500 nm InP

      DHBT

      10±2

      Cascode

      ×2

      1.0×0.81.8

    Table 2 shows the performance comparison of several wide band amplifiers. We noticed that this design provides the considerable gain,output power and bandwidth characteristics.

    4 Conclusion

    In this paper,a wide band amplifier is presented,which exhibits a good operating bandwidth(better than 1 dBm in the range of 35~134 GHz). The high 134.98% relative bandwidth completely covers the Q,V,W and D bands,which makes it a suitable option for measurement and spectroscopic systems. In the future,the cascode amplifier shown in this paper can be used as a cell to achieve greater output power through power combining.

    [2] YANG Fei, ZHAO Heng-Fei, LIU Jiang-Tao et al. Solid-state power amplifiers for space: going to extremely high frequency[J]. J. Infrared Millim. Waves, 40, 25-32(2021).

    [3] ZHONG Ying-Hui, LI Kai-Kai, LI Xin-Jian et al. A W-band high-gain and low-noise amplifier MMIC using InP-based HEMTs[J]. J. Infrared Millim. Waves, 34, 668-672(2015).

    [9] CHENG Wei, ZHANG You-Tao, WANG Yuan et al. 0.5μm InP DHBT technology for 100GHz+ mixed signal integrated circuits[J]. J. Infrared Millim. Waves, 36, 167-172(2017).

    [10] NIU Bin, CHEN Wei, ZHANG You-Tao et al. 0.5 μm InP/InGaAs DHBT for ultra high speed digital integrated circuit[J]. J. Infrared Millim.Waves, 35, 263-266(2016).

    [13] HOU Yan-Fei, WANG Bo-Wu, YU Wei-Hua et al. Parasitic modes caused by defect ground structure in multilayer integrated circuit[J]. Journal of Terahertz Science and Electronic Information Technology, 20, 626-630(2022).

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    Bo-Wu WANG, Wei-Hua YU, Yan-Fei HOU, Qin YU, Yan SUN, Wei CHENG, Ming ZHOU. A 33~170 GHz cascode amplifier based on InP DHBT technology[J]. Journal of Infrared and Millimeter Waves, 2023, 42(2): 197

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    Paper Information

    Category: Research Articles

    Received: Jul. 2, 2022

    Accepted: --

    Published Online: Jul. 19, 2023

    The Author Email: Ming ZHOU (zright@sina.com)

    DOI:10.11972/j.issn.1001-9014.2023.02.008

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