Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser

Hong-Yi LI; Zhi-Yong TAN; Wen-Jian WAN; Jun-Cheng CAO

doi:10.11972/j.issn.1001-9014.2024.03.009

Journal of Infrared and Millimeter Waves, Volume. 43, Issue 3, 354(2024)

Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser

Hong-Yi LI^1,2, Zhi-Yong TAN^1,2、*, Wen-Jian WAN^1,2, and Jun-Cheng CAO^1,2、**

¹National Key Laboratory of Materials for Integrated Circuits，Shanghai Institute of Microsystem and Information Technology，Chinese Academy of Sciences，Shanghai 200050，China

²Center of Materials Science and Optoelectronics Engineering，University of Chinese Academy of Sciences，Beijing 100049，China

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Hong-Yi LI, Zhi-Yong TAN, Wen-Jian WAN, Jun-Cheng CAO. Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser[J]. Journal of Infrared and Millimeter Waves, 2024, 43(3): 354

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Paper Information

Category: Research Articles

Received: Aug. 28, 2023

Accepted: --

Published Online: Apr. 29, 2024

The Author Email: Zhi-Yong TAN (zytan@mail.sim.ac.cn), Jun-Cheng CAO (jccao@mail.sim.ac.cn)

DOI:10.11972/j.issn.1001-9014.2024.03.009

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology