Etching Technology for Copper-Clad Laminates Based on Femtosecond Laser

Xiao Zhang; Kai Liu; Mingdi Wang; Yüji Ni; Yü Pan; Jincong Liu; Chao Ni; Wenjie Zhang

doi:10.3788/AOS201939.1214003

Acta Optica Sinica, Volume. 39, Issue 12, 1214003(2019)

Etching Technology for Copper-Clad Laminates Based on Femtosecond Laser

Xiao Zhang, Kai Liu, Mingdi Wang^*, Yüji Ni, Yü Pan, Jincong Liu, Chao Ni, and Wenjie Zhang

Author Affiliations

School of Mechanical and Electric Engineering, Soochow University, Suzhou, Jiangsu 215021, China

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Abstract Get PDF(in Chinese)

Figures & Tables(15)

Fig. 1. Ultra depth of field measurement results of FPC copper-clad laminate

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Fig. 2. Experimental scheme

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Fig. 3. FPC copper etching model and scanning path

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Fig. 4. Relationship among femtosecond laser power, depth, and roughness at the etched area of copper layer

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Fig. 5. Relationship among femtosecond laser frequency, depth, and roughness in the etched area of copper layer

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Fig. 6. Relationship among scanning speed of femtosecond laser, depth, and roughness in the etched area of copper layer

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Fig. 7. Relationship among femtosecond laser scanning times, depth, and roughness in the etched area of the copper layer

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Fig. 8. Relationship among femtosecond laser defocusing amount, depth, and roughness in the etched area of copper layer

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Fig. 9. Measurement results of 3D laser microscope. (a) Etching window; (b) 3D morphology

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Fig. 10. EDS measurement results of etched area. (a) Micro morphology of etched area; (b) EDS spectrum

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Table 1. Process parameters and experimental results of FPC copper laminate etched by femtosecond laser

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Table 1. Process parameters and experimental results of FPC copper laminate etched by femtosecond laser

Serial number	Power /mW	Scanning speed /(mm·s^-1)	Frequency /kHz	Scanning times	Defocusing amount /mm	Etching depth /μm	Roughness /μm
1	70	30	30	3	0	20.04	1.39
2	170	30	30	3	0	23.62	1.54
3	270	30	30	3	0	31.94	1.77
4	370	30	30	3	0	67.57	2.23
5	470	30	30	3	0	Through	Through
6	370	30	20	3	0	55.43	1.45
7	370	30	40	3	0	33.02	2.15
8	370	30	50	3	0	28.80	2.01
9	370	30	60	3	0	23.32	1.89
10	370	40	30	3	0	32.73	2.01
11	370	50	30	3	0	28.32	1.85
12	370	60	30	3	0	26.82	1.72
13	370	70	30	3	0	24.17	1.65
14	370	30	30	1	0	23.08	1.84
15	370	30	30	2	0	30.66	2.04
16	370	30	30	4	0	Through	Through
17	370	30	30	5	0	Through	Through
18	370	30	30	3	0.3	42.87	2.03
19	370	30	30	3	0.15	48.15	2.14
20	370	30	30	3	-0.15	69.77	2.97
21	370	30	30	3	-0.3	Through	Through

Table 2. Factor level table
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Table 2. Factor level table
Level Average power /mW Scanning speed /(mm·s^-1) Scanning times Defocusing amount /mm Repetition frequency /kHz
1 280 36 1 0.12 35.0
2 294 37 2 0.18 36.5
3 308 38 3 0.24 38.0
4 322 39 4 0.30 39.5

Table 3. Element arrangement and results of orthogonal test

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Table 3. Element arrangement and results of orthogonal test

Serial number	Level					Depth /μm	Roughness /μm
Serial number	A	B	C	D	E	Depth /μm	Roughness /μm
1	1	1	1	1	1	21.15	1.28
2	1	2	2	2	2	30.10	1.57
3	1	3	3	3	3	31.40	1.60
4	1	4	4	4	4	73.08	1.19
5	2	1	2	3	4	30.46	1.56
6	2	2	1	4	3	15.77	1.51
7	2	3	4	1	2	69.23	1.37
8	2	4	3	2	1	29.62	1.67
9	3	1	3	4	2	Through	Through
10	3	2	4	3	1	Through	Through
11	3	3	1	2	4	14.87	1.50
12	3	4	2	1	3	25.97	1.85
13	4	1	4	2	3	Through	Through
14	4	2	3	1	4	39.22	2.48
15	4	3	2	4	1	32.46	1.67
16	4	4	1	3	2	16.01	1.34

Table 4. Range analysis

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Table 4. Range analysis

Item	Level average	Power /mW	Scanning speed /(mm·s^-1)	Scanning times	Defocusing amount /mm	Frequency /kHz
Depth	k₁	38.93	50.70	16.95	38.89	39.71
	k₂	36.27	40.17	29.75	37.55	47.73
	k₃	48.01	36.99	45.96	38.37	37.18
	k₄	40.82	36.17	73.37	49.23	39.41
	Range	11.74	14.53	56.42	11.68	10.55
Roughness	k₁	1.41	1.42	1.41	1.75	1.54
	k₂	1.53	1.85	1.66	1.58	1.43
	k₃	1.68	1.54	1.92	1.50	1.65
	k₄	1.83	1.51	1.28	1.46	1.68
	Range	0.42	0.43	0.64	0.29	0.25

Table 5. Atomic number fraction of each element
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Table 5. Atomic number fraction of each element
Area Atomic number fraction /%
C O Cu
Original FPC board layer 0.2 1.1 98.7
Etched bottom area 74.3 24.9 0.2

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Xiao Zhang, Kai Liu, Mingdi Wang, Yüji Ni, Yü Pan, Jincong Liu, Chao Ni, Wenjie Zhang. Etching Technology for Copper-Clad Laminates Based on Femtosecond Laser[J]. Acta Optica Sinica, 2019, 39(12): 1214003

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