Journal of Infrared and Millimeter Waves, Volume. 25, Issue 2, 153(2006)
NOVEL THERMAL CYCLE SCREENING EQUIPMENT FOR CRYOGENIC SEMICONDUCTOR COMPONENTS WU Li-Gang LIU Da-Fu ZHU San-Gen WU Jia-Rong HONG Si-Min GONG Hai-Mei
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[3] [3] Ikuo Shohji,Hideo Mori,et al.Solder joint reliability evaluation of chip package using a modified Coffin-Manson equation [ J ].Microelectronics Reliability,2005,44 (2):269-274
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[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. NOVEL THERMAL CYCLE SCREENING EQUIPMENT FOR CRYOGENIC SEMICONDUCTOR COMPONENTS WU Li-Gang LIU Da-Fu ZHU San-Gen WU Jia-Rong HONG Si-Min GONG Hai-Mei[J]. Journal of Infrared and Millimeter Waves, 2006, 25(2): 153