Acta Physica Sinica, Volume. 68, Issue 17, 178501-1(2019)
Fig. 1. Process flow used for the fabrication of Ge n+/p junction diodes. Ge n+/p结二极管制备工艺流程图
Fig. 2. Room temperature
Fig. 3. Change of specific contact resistivity of Al/n+-Ge extracted by CTLM with different annealing conditions. The inset shows the CTLM schematic structure (top view). Al/n+-Ge接触的比接触电阻率随不同退火条件的变化曲线, 内插图是CTLM结构的俯视图
Fig. 4. (a) Room temperature
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Chen Wang, Yi-Hong Xu, Cheng Li, Hai-Jun Lin, Ming-Jie Zhao.
Received: May. 8, 2019
Accepted: --
Published Online: Sep. 16, 2020
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