AEROSPACE SHANGHAI, Volume. 42, Issue 4, 1(2025)
Key Technologies and Research Advances in RF Front-end Microsystems
Fig. 1.
Fig. 2. Simulated results of the package structure based on the LBFEM-POD method
Fig. 5. Multi-layer wiring process on the silicon-based MEMS photosensitive composite film[25]
Fig. 6. Cross-sectional view of micro bump based on Silicon-based MEMS photosensitive composite film fabrication process[26]
Fig. 7. Photographs and transmission characteristics of the packaged transmission lines
Fig. 9. Measured results of the electric field above the RF microsystem module
Fig. 10. Enhanced neural network structure with gradient loss constraints
Fig. 11. Photographs of the RF front-end of the proposed heterogeneous integration radar and the 1T2R heterogeneously-integrated phased-array radar[41]
Fig. 16. Thermal simulation results for the RF transmitting antenna microsystem
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Linsheng WU, Yi HUANG, Liang ZHOU, Min TANG, Xiaochun LI, Junfa MAO. Key Technologies and Research Advances in RF Front-end Microsystems[J]. AEROSPACE SHANGHAI, 2025, 42(4): 1
Category: Special Paper of Expert
Received: Jun. 10, 2025
Accepted: --
Published Online: Sep. 29, 2025
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