AEROSPACE SHANGHAI, Volume. 42, Issue 4, 1(2025)

Key Technologies and Research Advances in RF Front-end Microsystems

Linsheng WU1, Yi HUANG2, Liang ZHOU1, Min TANG1, Xiaochun LI1, and Junfa MAO3、*
Author Affiliations
  • 1State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai Jiao Tong University,Shanghai200240,China
  • 2Center for Microwave and RF Technology,Yangtze River Delta,Jiaxing314200,,China
  • 3State Key Laboratory of Radio Frequency Heterogeneous Integration,Shenzhen University, Shenzhen518060,,China
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    Figures & Tables(16)
    Multi-physics coupling effect of electromagnetic,thermal,and stress fields
    Simulated results of the package structure based on the LBFEM-POD method
    Schematic of feature region decomposition
    ETS multiphysics simulation software
    Multi-layer wiring process on the silicon-based MEMS photosensitive composite film[25]
    Cross-sectional view of micro bump based on Silicon-based MEMS photosensitive composite film fabrication process[26]
    Photographs and transmission characteristics of the packaged transmission lines
    Electromagnetic near-field scanning system
    Measured results of the electric field above the RF microsystem module
    Enhanced neural network structure with gradient loss constraints
    Photographs of the RF front-end of the proposed heterogeneous integration radar and the 1T2R heterogeneously-integrated phased-array radar[41]
    3D integrated transmitter[28]
    RF receiving antenna microsystem
    Measured results of the receiving antenna microsystem
    RF transmitting antenna microsystem
    Thermal simulation results for the RF transmitting antenna microsystem
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    Linsheng WU, Yi HUANG, Liang ZHOU, Min TANG, Xiaochun LI, Junfa MAO. Key Technologies and Research Advances in RF Front-end Microsystems[J]. AEROSPACE SHANGHAI, 2025, 42(4): 1

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    Paper Information

    Category: Special Paper of Expert

    Received: Jun. 10, 2025

    Accepted: --

    Published Online: Sep. 29, 2025

    The Author Email:

    DOI:10.19328/j.cnki.2096-8655.2025.04.001

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