With the development of electronic systems towards higher integration density and performance，conventional radio frequency （RF） integration technologies struggle to meet the demands，and the RF front-end microsystem technology based on three-dimensional （3D） heterogeneous integration has emerged as a critical breakthrough direction.This paper focuses on the application of the RF front-end microsystem technology in the aerospace field.The key scientific challenges requiring resolution are described，including the RF microsystem architecture，multi-physics coupling，and co-simulation design methodologies.Furthermore，the specific technological advancements in microsystem electronic design automation （EDA） tools，heterogeneous integration processes，and testing/verification methods are introduced.Additionally，the research achievements of the authors’ team in millimeter-wave band RF front-end microsystems are also presented.The RF front-end microsystem technology holds significant strategic importance for driving innovation in aerospace RF equipment，enhancing mission execution capabilities，and promoting civil-military integration.It serves as a core enabler for achieving high-performance，miniaturized RF devices in aerospace applications.