Chinese Journal of Lasers, Volume. 29, Issue s1, 225(2002)

Package Technique for High Power Diode Laser

TANG Chun1,2, GAO Song-xin1, YAN Di-yong1, SHAO Dong-zhu1, ZHUO Wei1, WU De-yong1, and CHEN Jun2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(4)

    [1] [1] T. J. Blanc, R. Ε. Niggemam, Μ. Β. Parekh. Soc. Autrnot. Eng.Paper, No. 831127,1983

    [2] [2] Ray Beach, William J. Benett, Barry L. Freitas et al.. Modular microchannels cooled heatsinks for high average power laser diode arrays. IEEE. J. Quantum Electron., 1992, 28(4):966~975

    [3] [3] Jurgen Jandeleit, Nicolas Wiedman, Andreas Ostlender et al.. Packaging and characterization of high power diode lasers. Proc. SPIE, 2000, 3945:270~277

    [4] [4] Hans-Georg Treusch, Jim Harrison, Bor Morris et al.. Compact high brightness and high power diode laser source for Materials processing. Proc. SPIE, 2000, 3945:23-31

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    TANG Chun, GAO Song-xin, YAN Di-yong, SHAO Dong-zhu, ZHUO Wei, WU De-yong, CHEN Jun. Package Technique for High Power Diode Laser[J]. Chinese Journal of Lasers, 2002, 29(s1): 225

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    Paper Information

    Category: laser devices and laser physics

    Received: --

    Accepted: --

    Published Online: Feb. 23, 2013

    The Author Email:

    DOI:

    CSTR:32186.14.

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