Fig. 1. Three typical microscopic images of water mark defects

Fig. 2. High-resolution XPS spectra of elements with water mark defect（a），（b），（c），and normal area（d），（e），（f）

Fig. 3. （a）Typical microscopic images of staining，（b）the response diagram，（c）the D* diagram，and（d）the noise diagram

Fig. 4. XPS high-resolution spectrum of Br 3d（a），C 1s（b），and C 1s（conductive adhesive）（c）

Fig. 5. （a）Typical microscopic images of round spot，（b）the response diagram，and（c）the the number of pixels contained in the circular dark spot（a small square represents a pixel）

Fig. 6. Typical microscopic images of round spot（a）and the SEM image of material defect（b）

Fig. 7. XPS high-resolution spectrum of Br 3d（a）and C 1s（b）

Fig. 8. Typical microscopic images and SEM images of normal area（a），（b），and over-roughness area（c），（d）

Fig. 9. SEM images of samples after CdTe film removed for normal area（a）and over-roughness area（b）

Fig. 10. SEM images of the sample without toluene immersion（a）the surface of HgCdTe，（b）the surface of CdTe，（c）the section structure of CdTe/HgCdTe，and the sample with toluene immersion（d）the surface of HgCdTe，（e）the surface of CdTe，（f）the section structure of CdTe/HgCdTe