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APPLIED LASER, Volume. 33, Issue 3, 318(2013)

Parameters Optimization of Process on Different Wavelength Laser Etching of Poly Silicon

Pei Shaohu1、*, XueWei2, Feng Aixin1,2,3, Sun Tietun3, Lv Yuwen1,4, Zhu Liang1, Zhu Baochun1, and Han Zhenchun1
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
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    Pei Shaohu, XueWei, Feng Aixin, Sun Tietun, Lv Yuwen, Zhu Liang, Zhu Baochun, Han Zhenchun. Parameters Optimization of Process on Different Wavelength Laser Etching of Poly Silicon[J]. APPLIED LASER, 2013, 33(3): 318

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    Paper Information

    Received: Nov. 5, 2012

    Accepted: --

    Published Online: Aug. 28, 2013

    The Author Email: Pei Shaohu (pei_shaohu@163.com)

    DOI:10.3788/al20133303.318

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology