Poly silicon are more widely used in the manufacture of solar cells because of its increasingly sophisticated manufacturing process and low cost. Due to the high efficiency, low consumption characteristics, the laser processing technology plays an important role in the field of solar cell manufacturing. In order to explore the impact of the laser processing parameters on the effects of processing, Based on orthogonal test method, by laser processing in polycrystalline silicon wafer surface for single point multiple pulse punch experiment method and through the optical microscope and three dimensional profilometer to analyze and observe experimental results, this paper established the relationship between process parameters and laser drilling morphology effects and optimized parameter that laser shock polysilicon tablet with, analyzed the heat affected zone around the hole. And the test got the best aperture laser processing parameters: With the action time 45s, laser wavelength of 532 nm, energy 120 mJ and spot diameter 0.5 mm.