Fig. 1. Schematic cross sections of integration between photonics and electronics.

Fig. 2. Conceptual model of photonics–electronics convergence system for interchip interconnects.

Fig. 3. Core width dependence of the waveguide propagation loss.

Fig. 4. Schematic structure and images of the optical modulator.

Fig. 5. DC response of the optical modulator.

Fig. 6. Schematic structure and SEM image of the PIN-PD.

Fig. 7. Frequency responses of the PDs.

Fig. 8. Microscope image of the 13-channel arrayed LD.

Fig. 9. Near field pattern and output intensity of the LD array.

Fig. 10. Schematic structure and SEM images of the trident SSC.

Fig. 11. Coupling losses of the trident SSC and an inversed taper SSC with various silicon core tip widths.

Fig. 12. Coupling losses between the LD and the trident SSC with various alignment deviations in the horizontal and vertical directions.

Fig. 13. I-L characteristics measured without temperature control.

Fig. 14. Fabricated silicon optical interposer.

Fig. 15. Eye diagram and BERs of PD output at 20 Gbps.