Microelectronics, Volume. 52, Issue 1, 144(2022)
Research on Optimal FBGA Solder Joints Reliability Based on Orthogonal Method
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SUN Qinrun, YANG Xuexia, ZHANG Weiwei, WANG Chao, LIU Zhaoyun, PENG Yinfei. Research on Optimal FBGA Solder Joints Reliability Based on Orthogonal Method[J]. Microelectronics, 2022, 52(1): 144
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Received: Aug. 1, 2021
Accepted: --
Published Online: Jun. 14, 2022
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