In the field of microelectronic packaging where the integration and power consumption of chips are increasing, the FBGA package has a larger storage capacity with the same volume. Based on the finite element and orthogonal method, the reliability performance of FBGA solder joints under thermal cycling load was analyzed, and a optimization design with more robust solder joint structural parameters was carried out. The results showed that the solder joint array had an important influence on the thermal reliability of the FBGA structure. The optimized combination scheme was the 12*12 solder joint array, where the radial size of the solder joint was 0.42 mm, the height was 0.38 mm, and the pitch was 0.6 mm. After optimization verification, the optimization scheme reduced the equivalent plastic strain range by 89.92% compared with the original design scheme, and the signal-to-noise ratio was increased to 17.72 dB, having achieved the purpose for optimizing the solder joint parameters.