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INFRARED, Volume. 46, Issue 3, 8(2025)

Optimization of Brazing Process for Dewar Windows in Infrared Detectors

Yun-long LI1, Xing SHEN2、*, Feng-shun WU1, Long-zao ZHOU1, Li-zhi SONG2, and Xiao-mai HONG2
Author Affiliations
  • 1School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan 430070, China
  • 2Wuhan Guide Infrared Co., Ltd., Wuhan 430205, China
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    [5] [5] Katsis D C, VanWyk J D. Thermal, Mechanical, and Electrical Study of Voiding in the Solder Die-attach of Power MOSFETs [J]. Transactions on Components and Packaging on Technologies, 2006, 29(1): 127136.

    [6] [6] Lin W C. The Void-free Reflow Soldering of BGA With Vacuum [C]. Hefei: 8th International Conference on Electronic Packaging Technology, 2007.

    [10] [10] Xu P, Wang B, Wang Y, et al. Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode [J]. TechRxiv, 2021, 14528163: 10.36227/tech-rxiv.14528163.v1.

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    LI Yun-long, SHEN Xing, WU Feng-shun, ZHOU Long-zao, SONG Li-zhi, HONG Xiao-mai. Optimization of Brazing Process for Dewar Windows in Infrared Detectors[J]. INFRARED, 2025, 46(3): 8

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    Paper Information

    Received: Nov. 12, 2024

    Accepted: Apr. 11, 2025

    Published Online: Apr. 11, 2025

    The Author Email: SHEN Xing (xingshen1987@163.com)

    DOI:10.3969/j.issn.1672-8785.2025.03.002

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology