High Power Laser and Particle Beams, Volume. 35, Issue 9, 099003(2023)

Experimental and numerical study of embedded microchannel heat sink

Wentao Jiang1, Rui Zhao2, and Wenlong Cheng1、*
Author Affiliations
  • 1College of Engineering Science, University of Science and Technology of China, Hefei 230026, China
  • 2School of Automotive and Transportation Engineering, Hefei University of Technology, Hefei 230009, China
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    Figures & Tables(15)
    Schematic diagram of flow circuit
    Schematic diagram of the heat sink, physical diagram of the package and microstructure of the two microchannels (S-shaped and rectangular)
    Distribution of serpentine heaters on the chip surface
    Variation of chip surface temperature with heat flow density
    Variation of maximum temperature difference on the chip surface with heat flow density
    S-shaped (S) and rectangular (R) microchannels with heat flow density as a function of the average temperature of the heat generating surface
    Variation of inlet and outlet pressure drop with heat flow density in S-shaped (S) and rectangular (R) microchannels
    Physical model of the heat sink for S-shaped microchannel
    Grid independence research and simulation verification
    Temperature, velocity nephogram and streamline diagram of manifold S-shaped and straight wall microchannels
    Effect of amplitude parameter A on heat transfer and flow performance of the microchannel
    Effect of frequency parameter B on heat transfer and flow performance of the microchannel
    • Table 1. Microchannel structure parameters

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      Table 1. Microchannel structure parameters

      type of channelschannel length lc/mm channel width wc/μm channel depth ld/μm aspect ratio of channel αfin width wf/μm substrate thickness lb/μm channel number n
      rectangular microchannel5171458.513350167
      S-shaped microchannel5161569.814350167
    • Table 2. Summary of structural parameters of the geometric model

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      Table 2. Summary of structural parameters of the geometric model

      channel length lc/mm channel width wc/μm fin width wf/μm channel depth ld/μm substrate thickness lb/μm inlet width lin/μm outlet width lout/μm diversion opening width ldiv/μm inlet fluid temperature Tin/K heat flux q″/(W·cm−2)
      51515150150400400200298300
    • Table 3. Physical parameters of HFE-7100 and Si

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      Table 3. Physical parameters of HFE-7100 and Si

      materialρ/(kg·m−3) cp/(J·kg−1·K−1 ) k/(W·m−1·K−1) μ/(Pa·s)
      HFE-71001511.231235.266.46×10−26.7917×10−4
      Si2330712148/
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    Wentao Jiang, Rui Zhao, Wenlong Cheng. Experimental and numerical study of embedded microchannel heat sink[J]. High Power Laser and Particle Beams, 2023, 35(9): 099003

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    Paper Information

    Category: Advanced Interdisciplinary Science

    Received: Apr. 1, 2023

    Accepted: May. 4, 2023

    Published Online: Oct. 17, 2023

    The Author Email: Cheng Wenlong (wlcheng515@163.com)

    DOI:10.11884/HPLPB202335.230071

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