[1] [1] LUO Y Q. Research and design of annealing kiln of float glass［D］. Chengdu: Chengdu University of Technology, 2009: 1-2(in Chinese).

[2] [2] UNGER U, WITTENBECHER W. The cutting edge of laser technology ［J］. Glass,1998,75: 101-103.

[3] [3] NISAR S, LI L, SHEIKH M A. Laser glass cutting techniques—A review ［J］. Journal of Laser Applications,2013,25(4):042010-042011.

[4] [4] LUMLEY R M. Controlled separation of brittle materials using a laser［J］.American Ceramic Society Bulletion,1969,48(1): 850-854.

[5] [5] TSAI C H, LIOU C S. Fracture mechanism of laser cutting with controlled fracture［J］. Journal of Manufacturing Science and Engineering, 2003,125(8):519-528.

[6] [6] TONSHOFF H K, OSTENDORF A, KULIK C, et al. Final glass products in one processing step by the means of laser radiation［C］//In Proceedings of the 22nd International Congress on Applications of Lasers and Electro-Optics. Jacksonville, USA:Laser Institute America, 2003 :71-80.

[7] [7] NISAR S, SHEIKH M A, LI L, et al. Effect of thermal stresses on chip-free diode laser cutting of glass［J］. Optics & Laser Technology,2009,41(3):318-327.

[8] [8] NURSE D, PATERSON N, TAWN A, et al. On the numerical modeling of laser shearing of glass sheets used to optimize production methods ［J］. Journal of Mechanical Engineering Science, 2004,218(1):218-229.

[9] [9] WANG X H, YAO J H, ZHOU G B, et al. Research of the technology of laser cutting LCD glass substrates based on thermal cracking method［J］. Laser Technology, 2011,35(4)：472-476 (in Chinese).

[10] [10] WANG Ch G,ZHOU G B, LU Y L, et al. Research of cutting LCD-glass with thermal cracking method based on thermal weight function technology［J］. Chinese Journal of Lasers, 2014,12(41):1203005(in Chinese).

[11] [11] AKARAPU R, SEGALL A E. Investigation of an active stressing technique for delaying fracture during laser cutting of alumina［C］//International Mechanical Engineering Congress and Exposition. Anaheim California, USA: American Society of Mechanical Engineers, 2004, 15:173-179.

[12] [12] YAHATA K,YAMAMOTO K. Crack propagation analysis in laser scribing of glass［J］. Journal of Laser Micro/Nano Engineering, 2010,5(2):109-114.

[13] [13] LIN H Y, HUANG X H, XU Y Ch, et al. Research progress of graphene passively Q-switched Nd3+-doped lasers［J］. Laser Technology, 2016,40(2): 259-263(in Chinese).

[14] [14] XIA J, JIANG G B, ZHAO Ch J. Numerical study on thulium-doped mode-lock fiber laser with high modulation depth of saturable aborsber［J］.Laser Technology, 2016,40(2): 259-263(in Chinese).

[15] [15] LIU H, FENG L Q. Mid-infrared field phase measurement and attosecond pulse generation［J］.Laser Technology, 2017,41(2):151-158(in Chinese).

[16] [16] SOLDATOV A N, MIRZA Y S, POLUNIN Y P. Thermal cleavage of optical glass by strontium-vapor laser radiation［J］. Glass and Ceramics,2015, 71(12): 379-382.

[17] [17] KITAMURA R, PILON L, JONASZ M. Optical constants of silica glass from extreme ultraviolet to far infrared at near room temperature ［J］. Applied Optics, 2007,46(33):8118-8133.

[18] [18] AWAJIHI D, HONDA S, NISHIKAWA T. Thermal shock parameters of ceramics evaluated by infrared radiation heating［C］// JSME International Journal Series A (Solid Mechanics and Material Engineering). Tokyo, Japan: Japan Society of Mechanical Engineerings, 1997:414-436.

[19] [19] YANGS T, MATTHEWS M J, ELHADJ S. Thermal transport in CO2 laser irradiated fused silica in situ measurements and analysis［J］. Journal of Applied Physics, 2009, 106(10):1031061-1031067.

[20] [20] YANG S T, MATTHEWS M J, ELHADJ S, et al. Comparing the use of mid-infrared versus far-infrared lasers for mitigating damage growth on fused silica ［J］. Journal of Applied Optics, 2010, 49(14): 2606-2616.