[1] [1] Lim K B, Lee D C. Surface and Interface Analysis, 2004, 36(3): 254.

[2] [2] Kogelschatz U. Plasma Chemistry and Plasma Processing, 2003, 23(1): 41.

[3] [3] Khacef A, Cormier J M, Pouvesle J M. J. Phys. D: Appl Phys., 2002, 35: 1491.

[4] [4] Greg A, Cheong M, Arjomandi M, et al. AIAA, 2012-0821.

[5] [5] Anderson T, Alexeff I, Parameswaran S. et al. IEEE trans. on Plasma Sci., 2006, 34: 166.

[6] [6] Destler W W, DeGrange J E, Fleischmann H H, et al. J. Appl. Phys., 1991, 69(9): 6313.

[7] [7] Donnelly V M. J. Phys. D: Appl. Phys., 2004, 37(4): R217.

[8] [8] Zhao W H, Tian K, Tang H Z, et al. J. Phys. D, 2002, 35: 2815.

[9] [9] Huang S, Xin Y, Ning Z Y. Chin. Phys., 2005, 14(8): 1608.

[11] [11] Gordillo-Vazquez F J, Camero M, Gomez-Aleixandre C. Plasma Sources Sci. Technol., 2006, 15(1): 42.

[12] [12] Vandersijde B, Vandermullen J A M. J. Quant. Spectrosc. Radiat. Transfer., 1990, 44(1): 39.

[13] [13] Fujimoto T. J. Phy. Soc. Jpn., 1979, 47(1): 273.

[14] [14] Daltrini A M, Moshkalev S A, Monteiro M J R, et al. J. Appl. Phys., 2007, 101(7): 073309.

[15] [15] Boffard J B, Lin C C. J. Phys. D: Appl. Phys., 2004, 37(12): R143.