OPTICS & OPTOELECTRONIC TECHNOLOGY, Volume. 20, Issue 1, 43(2022)
Simulation Research on Height Measurement of Bump Package Based on White Light Triangulation Method
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YE Rui-qian, ZHENG Peng, WANG Lei, ZHANG Zi-li, MENG Fan-chang. Simulation Research on Height Measurement of Bump Package Based on White Light Triangulation Method[J]. OPTICS & OPTOELECTRONIC TECHNOLOGY, 2022, 20(1): 43
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Received: May. 17, 2021
Accepted: --
Published Online: Mar. 16, 2022
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CSTR:32186.14.
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