With the development of integrated circuit manufacturing technology, the package size has become more compact, and the problem of interconnection short-circuit caused by solder deformation has become more prominent. The need for coplanarity defect detection for chip bumps, the measurement of bump height, is more urgent. To achieve this goal, A simulation model of chip bump height measurement is established based on white light triangulation. The system is divided into a light source shaping module, a precision slit, a microscopic projection system, and a microscopic imaging system. The analysis of the change of the reflected light spot on the top of the bump is focused during the movement of the sample. The influence of the convergent light and traditional parallel light of the system is compared on the imaging light spot on the top of the bump. Based on the above analysis, a method suitable for the detection of the height of the bump is proposed and the simulation results are used.