Preface to the Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications

Yongfeng Mei; Wei Gao; Hui Fang; Yuan Lin; Guozhen Shen

doi:10.1088/1674-4926/41/4/040101

Journal of Semiconductors, Volume. 41, Issue 4, 040101(2020)

Preface to the Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications

Yongfeng Mei¹, Wei Gao², Hui Fang³, Yuan Lin⁴, and Guozhen Shen⁵

Author Affiliations

¹Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, China

²Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA

³Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA

⁴State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China

⁵State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China

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Yongfeng Mei, Wei Gao, Hui Fang, Yuan Lin, Guozhen Shen. Preface to the Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications[J]. Journal of Semiconductors, 2020, 41(4): 040101

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Paper Information

Category: Editorial

Received: --

Accepted: --

Published Online: Sep. 10, 2021

The Author Email:

DOI:10.1088/1674-4926/41/4/040101

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