Laser & Optoelectronics Progress, Volume. 60, Issue 7, 0714010(2023)

Effect of Laser Remelting Path on Residual Stress and Surface Quality of Remanufactured Coatings

Jiasheng Wang1,2、* and Linsen Shu1,2
Author Affiliations
  • 1School of Mechanical Engineering, Shaanxi University of Technology, Hanzhong 723001, Shaanxi, China
  • 2Shaanxi Key Laboratory of Industrial Automation, Hanzhong 723001, Shaanxi, China
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    Figures & Tables(13)
    Finite element mesh model of laser remelting
    Various parameters of Ni60
    Schematic diagram of remelting path
    Cloud diagrams of temperature field distribution during remelting process
    Instantaneous temperature history curves at the surface nodes of cladding layer
    Instantaneous stress history curve of node N1
    Cloud diagrams of residual stress distribution. (a) Laser cladding; (b) L1; (c) L2; (d) L3
    Deformation cloud maps of cladding workpiece. (a) Laser cladding; (b) L1; (c) L2; (d) L3
    Non-destructive testing of residual stress of cladding sample. (a) Diffraction geometric pattern of residual stress measurement; (b) residual stress test
    Experimental and simulation values of sample residual stress
    Surface morphologies of cladding layer. (a) Laser cladding; (b) L1; (c) L2; (d) L3
    • Table 1. Main chemical composition of Ni60 powder for test

      View table

      Table 1. Main chemical composition of Ni60 powder for test

      ElementCCrSiBNiFe
      Mass fraction /%0.5-1.014-193.5-5.03.0Bal.<2.5
    • Table 2. Main chemical composition of 40Cr board for test

      View table

      Table 2. Main chemical composition of 40Cr board for test

      ElementCCrSiMnPSCuMoFe
      Mass fraction /%0.37-0.430.8-1.10.17-0.350.5-0.8≤0.035≤0.035≤0.30≤0.10Bal.
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    Jiasheng Wang, Linsen Shu. Effect of Laser Remelting Path on Residual Stress and Surface Quality of Remanufactured Coatings[J]. Laser & Optoelectronics Progress, 2023, 60(7): 0714010

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    Paper Information

    Category: Lasers and Laser Optics

    Received: Feb. 4, 2022

    Accepted: Mar. 29, 2022

    Published Online: May. 24, 2023

    The Author Email: Jiasheng Wang (893415819@qq.com)

    DOI:10.3788/LOP220895

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