[3] [3] LI Zh Y, NIU Z W. Convergence analysis of the numerical solution for cathode design of aero-engine blades in electrochemical machining[J]. Chinese Journal of Aeronautics, 2007, 20(6): 570-576.

[7] [7] BUERLE D. Laser processing and chemistry[M]. Berlin, Germany: Springer, 2011: 13-18.

[10] [10] ZHU S, LU Y F, HONG M H,et al. Laser ablation of solid substrates in water and ambient air[J]. Journal of Applied Physics, 2001, 89(4): 2400-2403.

[11] [11] YANG G W. Laser ablation in liquids: Applications in the synthesis of nanocrystals[J]. Progress in Materials Science, 2007, 52(4): 648-698.

[12] [12] KRUUSING A. Underwater and water-assisted laser processing: Part 1—General features, steam cleaning and shock processing[J]. Optics and Lasers in Engineering, 2004, 41(2): 307-327.

[13] [13] WEE L M, NG E Y K, PRATHAMA A H,et al. Micro-machining of silicon wafer in air and underwater[J]. Optics & Laser Technology, 2011, 43(1): 62-71.

[14] [14] LIU H W, CHEN F, WANG X H,et al. Influence of liquid environments on femtosecond laser ablation of silicon[J]. Thin Solid Films, 2010, 518(18): 5188-5194.