Optoelectronic Technology, Volume. 42, Issue 2, 123(2022)

Heat Dissipation Optimization Method for the Backlight Module of High⁃brightness Rugged Display

Yajun SHAN1,2, Guangming TANG1,2, Chen SHENG1,2, and Qiubai YAN1,2
Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Research Center,Nanjing 10016,CHN
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    Figures & Tables(18)
    Diagram of backlight module
    Diagram of heat dissipation path of the backlight module
    Temperature distribution of the backlight module(conventional thermally conductive tape)
    Temperature distribution of the backlight module(new thermally conductive tape)
    Temperature situation of the backlight support board
    Diagram of heat dissipation at the backside of the dispplay
    Diagram of cooling grid
    Diagrams of rear shell design before and after optimization
    Photos of appearance before and after optimization
    Temperature distribution of the display before and after optimization
    Temperature situation of the display before and after optimization
    Temperature distribution of the rear shell before optimization
    Temperature distribution of the rear shell after optimization
    • Table 1. Parameters comparison between new thermally conductive tape and conventional thermally conductive tape

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      Table 1. Parameters comparison between new thermally conductive tape and conventional thermally conductive tape

      项目常规导热胶带新型导热胶带
      颜色浅褐色白色
      厚度/mm0.2±0.020.125±0.02
      热传导系数/(w·mk-10.41.5~3.0
      使用温度/(℃)-30~125-40~120
    • Table 2. Temperature difference between different interfaces of the backlight module

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      Table 2. Temperature difference between different interfaces of the backlight module

      LED

      温度/(℃)

      PCB

      温差/(℃)

      界面

      温差/(℃)

      背光支板温差/(℃)总温差/(℃)
      常规导热胶带0.531.0忽略4.5
      新型导热胶带0.530.1忽略3.6
    • Table 3. Temperature distribution of the backlight module in the test

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      Table 3. Temperature distribution of the backlight module in the test

      界面材料LED温度/(℃)结构温度/(℃)

      实测总

      温差/(℃)

      理论计算总温差/(℃)
      常规导热胶带41.036.54.54.5
      新型导热胶带40.036.53.53.6
    • Table 4. Environmental parameters

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      Table 4. Environmental parameters

      背光功耗/W发热效率(%)环境温度/(℃)
      35.57025
    • Table 5. Temperature distribution of each measuring point in the display

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      Table 5. Temperature distribution of each measuring point in the display

      测点优化前温度/(℃)优化后温度/(℃)温度降低值/(℃)
      B148.943.35.6
      B252.445.17.3
      B34943.25.8
      B450.543.47.1
      S144.840.14.7
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    Yajun SHAN, Guangming TANG, Chen SHENG, Qiubai YAN. Heat Dissipation Optimization Method for the Backlight Module of High⁃brightness Rugged Display[J]. Optoelectronic Technology, 2022, 42(2): 123

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    Paper Information

    Category: Research and Trial-manufacture

    Received: Dec. 28, 2021

    Accepted: --

    Published Online: Jul. 29, 2022

    The Author Email:

    DOI:10.19453/j.cnki.1005-488x.2022.02.008

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